Zobrazeno 1 - 2
of 2
pro vyhledávání: '"G. Yaadhav Raaj"'
Autor:
S. Arun Kumar, G. Srayes, R. Gopala Krishnan, G. Yaadhav Raaj, Eng Soon Tok, Michael Pecht, Xu Ke
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Ferromagnetic incorporated lead/solder materials have the potential to achieve localized melting of the solder through electromagnetic induction (EMI) and represent a promising improvement in today's electronic solder-joint technology. Precise heatin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6a7807a096f65be0029e2bcc37a6eee0
https://doi.org/10.1109/ectc.2016.276
https://doi.org/10.1109/ectc.2016.276
