Zobrazeno 1 - 10
of 57
pro vyhledávání: '"G. Umamaheswara Reddy"'
Publikováno v:
e-Prime: Advances in Electrical Engineering, Electronics and Energy, Vol 5, Iss , Pp 100247- (2023)
This paper presents an investigation of crosstalk issues for coupled heterogeneous coaxial through silicon vias (HCTSVs) in ternary logic. Crosstalk issues are investigated for coupled HCTSVs using Cu-MWCNT as a conductive filler and polymer liners s
Externí odkaz:
https://doaj.org/article/559e3100aa3f4e849c8d0c05191d85d0
Publikováno v:
Cleaner Engineering and Technology, Vol 10, Iss , Pp 100551- (2022)
Dynamics in Limestone mining sites are usually subjected to spatiotemporal land cover change, which has a long-term impact on the land and environment. The objectives of this article are mapping demarcation, and transformation assessment of active ca
Externí odkaz:
https://doaj.org/article/c9af8b19579b4fe7a8de60932b67a413
Autor:
C, Venkata Sudhakar1,2 (AUTHOR) sudhakar.chowdam@gmail.com.https://orcid.org/0000-0002-0205-4470, G, Umamaheswara Reddy1 (AUTHOR)
Publikováno v:
International Journal of Knowledge Based Intelligent Engineering Systems. 2023, Vol. 27 Issue 2, p133-148. 16p.
Design of Cu-MWCNT Based Heterogeneous Coaxial through Silicon Vias for High-Speed VLSI Applications
Publikováno v:
Russian Microelectronics. 51:512-520
Publikováno v:
Journal of Applied and Natural Science. 14:746-761
For emerging countries, mining has been a vital factor in employment, economic development, infrastructure, and supply of essential raw materials for Nation’s Gross domestic product (GDP) growth. The Limestone mine industry is serving as a viable r
Publikováno v:
Materials Today: Proceedings.
Publikováno v:
Materials Today: Proceedings.
Publikováno v:
International Journal of Intelligent Systems and Applications in Engineering. 10:75-86
Publikováno v:
Russian Microelectronics; Aug2023, Vol. 52 Issue 4, p317-324, 8p
Publikováno v:
Lecture Notes in Electrical Engineering ISBN: 9789811977527
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dd76ae791a07d10ca38e0517278f3fac
https://doi.org/10.1007/978-981-19-7753-4_56
https://doi.org/10.1007/978-981-19-7753-4_56