Zobrazeno 1 - 10
of 39
pro vyhledávání: '"G. Sai Saravanan"'
Publikováno v:
IEEE Access, Vol 9, Pp 141504-141512 (2021)
This paper presents design, mathematical analysis, and measurement of low noise single-stage transimpedance amplifier (TIA) with scalable bandwidth using 130 nm bipolar complementary metal-oxide-semiconductor (BiCMOS) silicon-germanium (SiGe) process
Externí odkaz:
https://doaj.org/article/61f9c6b656094bf39868aaf2a529328d
Publikováno v:
IEEE Access, Vol 9, Pp 141504-141512 (2021)
This paper presents design, mathematical analysis, and measurement of low noise single-stage transimpedance amplifier (TIA) with scalable bandwidth using 130 nm bipolar complementary metal-oxide-semiconductor (BiCMOS) silicon-germanium (SiGe) process
Publikováno v:
2022 32nd International Conference Radioelektronika (RADIOELEKTRONIKA).
Publikováno v:
2021 2nd International Conference on Range Technology (ICORT).
This paper presents the design and demonstration of a 35 GHz transmitter for RF-over-fiber (RFoF) communication link using complementary metal-oxide-semiconductor (CMOS) compatible silicon-photonics technology. This proof of the concept has addressed
Publikováno v:
International Journal of Circuit Theory and Applications. 47:542-548
This paper presents the design and implementation of a 7-bit S-band digital passive phase shifter using Complementary Metal-Oxide-Semiconductor (CMOS) 65-nm technology in 2.6- to 3.2-GHz frequency band. New switched delay network topology has been us
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Autor:
S. Dhamodaran, K. Muraleedharan, Rangarajan Muralidharan, D.V. Sridhara Rao, K. Mahadeva Bhat, Anand P. Pathak, G. Sai Saravanan, H. P. Vyas, R. Balamuralikrishnan
Publikováno v:
Materials Science in Semiconductor Processing. 30:62-74
During post-deposition alloying of AuGe/Ni/Au ohmic contacts to microwave transistors, there is interdiffusion of alloy materials and GaAs into each other. Outdiffusion from substrate greatly influences the surface roughness of the contacts as a func
Autor:
D. C. Agarwal, Anand P. Pathak, G. Sai Saravanan, N. Srinivasa Rao, Pawan K. Kulriya, D.K. Avasthi, N. Sathish, V. Saikiran, G. Devaraju
Publikováno v:
Solid State Communications. 150:2122-2126
Ge nanocrystals embedded in an SiO2 matrix were prepared by the atom beam co-sputtering (ABS) method from a composite target of Ge and SiO2. The as-deposited films were rapid thermally annealed at the temperatures 700 and 800 °C in nitrogen ambience
Publikováno v:
Progress In Electromagnetics Research C. 16:111-125
Packaging of planar MMICs poses a unique challenge at microwave frequencies as the dimensions of the encapsulating cavity are comparable to wavelength at the operational frequencies. In addition, the efiect of ground loops (caused by bond wires expos
Publikováno v:
Radiation Effects and Defects in Solids. 163:737-748
The active layers of Metal Semiconductor Field Effect Transistors (MESFETs) are obtained by Si29+ ion implantation in GaAs. Implantation was done at 35 keV with a higher dose near the wafer surface for facilitating easier formation of ohmic contacts,