Zobrazeno 1 - 10
of 122
pro vyhledávání: '"G. Refai-Ahmed"'
Autor:
G. Refai-Ahmed, H. Kabbani, H. Alissa, B. Sammakia, T. Cader, V. Gektin, S. Ramalingam, Anthony Torza
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a0c48efa56a3e1d8181a8a157c26826
https://doi.org/10.1109/eptc56328.2022.10013165
https://doi.org/10.1109/eptc56328.2022.10013165
Autor:
S. Shah, S. G. Pytel, G. Refai-Ahmed, T. Pawlak, Y. Bhartiya, B. Boots, H. Shi, D. Ostergaard, M. Keshavamurthy
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
The authors provide a new modeling approach for the simulation of thermo-electro-mechanical stress effects within PCBs (printed circuit boards) and electronic packages. Difficult design challenges created by these effects occur throughout the full ra
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b51bb20896a8f64ec025e8bc4bdd8737
https://doi.org/10.1109/ectc.2016.196
https://doi.org/10.1109/ectc.2016.196
Autor:
K.V. Karimanal, G. Refai-Ahmed
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 26:610-615
This work focuses on the application of compact conduction model (CCM) creation approach to ball grid array (BGA) packages under steady state conditions. The procedure of creating CCM from detailed BGA model is demonstrated. The authors have imposed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96e64932da41ab222ce52ec5530f1d81
https://doi.org/10.1109/tcapt.2003.817653
https://doi.org/10.1109/tcapt.2003.817653
Publikováno v:
Journal of Thermophysics and Heat Transfer. 11:223-231
Forced convection heat transfer from isothermal spheres is examined over a wide range of Reynolds numbers, turbulence intensities, and Prandtl numbers using experimental and analytical techniques. An approximate analytical solution is presented that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7015e710bd40a56dba53ee1cbd19d8ef
https://doi.org/10.2514/2.6226
https://doi.org/10.2514/2.6226
Autor:
G. Refai Ahmed, M. Michael Yovanovich
Publikováno v:
Journal of Thermophysics and Heat Transfer. 9:516-523
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fe14e9e2017038f48f2d4dc57abc534
https://doi.org/10.2514/3.695
https://doi.org/10.2514/3.695
Autor:
M. Michael Yovanovich, G. Refai Ahmed
Publikováno v:
Journal of Heat Transfer. 116:838-843
A new, simple and approximate analytical method based on linearization of the energy equation is proposed to develop solutions for forced convection heat transfer from isothermal spheres. Furthermore, heat transfer correlations from spheres are propo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d380aaff0b747f8330e66ffac8030e2
https://doi.org/10.1115/1.2911456
https://doi.org/10.1115/1.2911456
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2.
Heat transfer characteristics of an aluminum plate pulsating heat pipe (PHPs) were investigated experimentally. Sizes, consisting of parallel and square channels as well as different cross-sections and different number of turns were considered. Aceto
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a694b0594cad803fef99983e036088e2
https://doi.org/10.1115/ipack2011-52018
https://doi.org/10.1115/ipack2011-52018
Publikováno v:
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2.
Loop heat pipe (LHP) is a highly efficient cooling device. It has gained great attention in the electronics cooling industry due to its superior heat transport capability — that is, its ability to carry heat over long distances. For this article, a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::39a1bf5bdb0bce3b166312ce19d6a571
https://doi.org/10.1115/ipack2011-52017
https://doi.org/10.1115/ipack2011-52017
Autor:
G. Refai Ahmed, M. Michael Yovanovich
Publikováno v:
Journal of Electronic Packaging. 113:268-274
A numerical study is carried out to investigate the influence of discrete heat sources on natural convection heat transfer in a square enclosure filled with air. The enclosure has two vertical boundaries of height H; one of them is cooled at Tc and t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::97c60133523e2b354694126028942830
https://doi.org/10.1115/1.2905406
https://doi.org/10.1115/1.2905406
Autor:
G. Refai-Ahmed, K. Sheltami
Publikováno v:
ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).
Thermal management plays an important role in the design of optical modules. The main objective in the thermal design of an optical module is to minimize its size in order to have very dense packaging in the card level. This can lead to a significant
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d69b05e47624ce7483f49db79bb4f76a
https://doi.org/10.1109/itherm.2002.1012527
https://doi.org/10.1109/itherm.2002.1012527