Výsledky vyhledávání - "G. Le Quilliec"

Quantitative analysis of porosity and transport properties by FIB-SEM 3D imaging of a solder based sintered silver for a new microelectronic component

Autor: T. Le Bihan, S. Chupin, Wafaa Rmili, Caroline Richard, G. Le Quilliec, Nicolas Vivet

Publikováno v: Journal of Electronic Materials
Journal of Electronic Materials, 2016, 45 (4), pp.2242-2251. ⟨10.1007/s11664-015-4288-1⟩
Journal of Electronic Materials, Institute of Electrical and Electronics Engineers, 2016, 45 (4), pp.2242-2251. ⟨10.1007/s11664-015-4288-1⟩

International audience; As part of development of a new assembly technology to achieve bonding for an innovative silicon carbide (SiC) power device used in harsh environments, the aim of this study is to compare two silver sintering profiles and then

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9039847c424ac048499d533d80ddb6fd
https://hal.science/hal-01333197

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Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity

Autor: Régis Meuret, Caroline Richard, Eric Woirgard, Donatien Martineau, Wafaa Rmili, G. Le Quilliec, Stephane Azzopardi, Toni Youssef, Nicolas Vivet

Publikováno v: Microelectronics Reliability
Microelectronics Reliability, 2015, 55 (9-10), pp.1997-2002. ⟨10.1016/j.microrel.2015.06.085⟩
Microelectronics Reliability, Elsevier, 2015, 55 (9-10), pp.1997-2002. ⟨10.1016/j.microrel.2015.06.085⟩

International audience; Along with the need to drastically limit the emission of greenhouse gases, the increase of electric or hybrid solutions in the market mostly relies on their dependability with a specific focus on reliability of the embedded po

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a453f4145b6af53fa9a9b87986e7e8cb
https://hal.science/hal-01333171

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Constitutive modelling of the densification process in silica glass under hydrostatic compression

Autor: Jean-Christophe Sanglebœuf, S. Gicquel, P. Pilvin, J. X. Meng, G. Le Quilliec, Jean-Pierre Guin, Ludovic Charleux, Tanguy Rouxel, Vincent Keryvin

Publikováno v: Acta Materialia
Acta Materialia, 2014, 62, pp.250-257. ⟨10.1016/j.actamat.2013.07.067⟩
Acta Materialia, Elsevier, 2014, 62, pp.250-257. ⟨10.1016/j.actamat.2013.07.067⟩

The mechanical response of amorphous silica (or silica glass) under hydrostatic compression for very high pressures up to 25 GPa is modelled via an elastic–plastic constitutive equation (continuum mechanics framework). The material parameters appea

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1b36cb959bf059d93fd69105def782e5

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Modélisation du martelage à haute fréquence des assemblages soudés

Autor: Laurent Jubin, Geneviève Inglebert, M. Afzali, G. Le Quilliec, Henri-Paul Lieurade, Pascal Macquet, Monssef Drissi-Habti

Publikováno v: Matériaux & Techniques
Matériaux & Techniques, EDP Sciences, 2012, 100 (4), pp.309-316. ⟨10.1051/mattech/2012030⟩

National audience; Les joints soudés présentent bien souvent une durée de vie en fatigue relativement faible comparée à celle des matériaux de base et d’apport qui les composent. Plusieurs techniques d’amélioration post-soudage ont par con

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b9b62ed220b1d8a2abc3f550b8cab843
https://hal.archives-ouvertes.fr/hal-01332886

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