Zobrazeno 1 - 10
of 24
pro vyhledávání: '"G. Heidelberger"'
Autor:
Jozef Novák, Roman Stoklas, Peter Kordos, Dagmar Gregušová, K. Cico, M. Marso, G. Heidelberger
Publikováno v:
physica status solidi c. 4:2720-2723
We report on AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOSHFETs) with MOCVD deposited Al2O3 as a gate oxide. Properties of MOSHFETs with 9 nm and 14 nm thick Al2O3 are compared with conventional HFETs prepared simu
Autor:
Hilde Hardtdegen, G. Heidelberger, N. Kaluza, H. L. Bay, Michel Marso, Yong Suk Cho, Konrad Wirtz, R. Steins, M. von der Ahe
Publikováno v:
Applied Physics A. 87:491-498
This paper reports on new approaches for growth control of GaN-based heterostructures for high frequency and high power application. First in situ methods are presented and their further development discussed [1]. The development leads to a greatly i
Publikováno v:
IEEE Transactions on Electron Devices. 53:1517-1523
In this paper, the influence of a 10-nm-thick silicon-dioxide layer, as a passivation or as a gate insulation, on the performance of heterojunction field-effect transistors (HFETs) and metal-oxide-semiconductor HFETs (MOSHFETs), based on an undoped A
Publikováno v:
physica status solidi c. 3:2261-2264
The optoelectronic properties of MSM diodes that are based on an AlGaN/GaN HEMT layer system are investigated as function of the applied bias. For low voltages, the two-dimensional electron gas acts as a barrier for the depletion layer. Therefore, on
Publikováno v:
physica status solidi (a). 203:1876-1881
In this comparative study we investigate AlGaN/GaN-based unpassivated and passivated HFETs and MOSHFETs with regards to DC-, RF-, and power-performance. For optimal comparability, all devices emanate from the same wafer consisting of a SiC-substrate,
Publikováno v:
IEEE Electron Device Letters 27, 945-947 (2006). doi:10.1109/LED.2006.886705
In this letter, the performance of AlGaN/GaN-based metal-semiconductor-metal (MSM) varactor diodes based on HFET and MOSHFET layer systems is investigated. Passivated HFET MSM devices are coated with a 10-nm-thick SiO2 layer between the electrodes; i
Publikováno v:
2006 International Conference on Advanced Semiconductor Devices and Microsystems.
An increased RF-Performance of heterojunction field-effect transistor was found to be due to passivation and in addition a SiO2 insulation underneath the gate matallization. This leads to an increase of cutoff frequency from 17 GHz up to 24 GHz for d
Autor:
M. Roeckerath, M. Marso, A. Fox, R. Steins, N. Kaluza, Hans Lüth, Peter Kordos, G. Heidelberger, J. Schubert, M. Stefaniak
Publikováno v:
2006 International Conference on Advanced Semiconductor Devices and Microsystems.
Starting out from our well established process for AlGaN/GaN HFETs, the authors discuss ways to enrich the process in order to fabricate metal-oxide-semiconductor HFETs (MOSHFETs) with a gadolinium scandate (GdScO3) insulation layer. In particular, a
Publikováno v:
Second International Conference on 3G Mobile Communication Technologies (3G 2001).
The CDMA based UMTS transmission technology in which all users simultaneously share the same common range of spectrum gets rather affected by the system interference. The reduction of interference is therefore a key issue in the development of optima
Publikováno v:
Applied physics letters 87, 143501 (2005). doi:10.1063/1.2058206
We report on SiO2/AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors (MOSHFETs), which exhibit a 6.7 W/mm power density at 7 GHz. Unpassivated and SiO2-passivated heterostructure field-effect transistors (HFETs) were also in