Zobrazeno 1 - 10
of 165
pro vyhledávání: '"G. Carchon"'
Publikováno v:
IEEE Transactions on Microwave Theory and Techniques. 56:2893-2901
Miniature, light weight and low-loss filters are important components for wireless and mm-wave applications. Here, we present a novel implementation of integrated cavities on a thin-film technology with through-substrate vias on 100 mum thick high-re
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1146a6f45f5fc117b1e9a94fc4013f40
https://doi.org/10.1109/tmtt.2008.2007184
https://doi.org/10.1109/tmtt.2008.2007184
Autor:
G. Carchon, Walter De Raedt, Eric Beyne, Maarten Kuijk, Steven Brebels, Bart Nauwelaers, J. Balachandran
Publikováno v:
Vrije Universiteit Brussel
As integrated circuit technology enters the nanometer era, global interconnects are becoming a bottleneck for overall chip performance. In this paper, we show that wafer-level package interconnects are an effective alternative to conventional on-chip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::854257aa29d1025215e3642d3e54a7dc
https://doi.org/10.1109/tvlsi.2006.878229
https://doi.org/10.1109/tvlsi.2006.878229
Publikováno v:
Microelectronics International. 20:26-30
High Q on‐chip inductors and low loss on‐chip interconnects and transmission lines are an important roadblock for the further development of Si‐based technologies at RF and microwave frequencies. In this paper, inductors are realized on standar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4ba5c0baa7cdca7ec55212d8b826c06f
https://doi.org/10.1108/13565360310455490
https://doi.org/10.1108/13565360310455490
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 24:510-519
Thin-film multi-layer MCM-D technology using the system in a package concept is presented as a viable approach for the integration of high performance wireless front-end systems. Due to the high quality dielectrics and copper metallization, high qual
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9476423bfbf15b06ce99b5701e7e0317
https://doi.org/10.1109/6144.946500
https://doi.org/10.1109/6144.946500
Publikováno v:
ChemInform. 29
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::89553694a73bf6b6c89ede67b4c2ea44
https://doi.org/10.1002/chin.199847246
https://doi.org/10.1002/chin.199847246
Publikováno v:
Short-Range Wireless Communications: Emerging Technologies and Applications
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e2d24ba17baca606707fa68d780f84e
https://doi.org/10.1002/9780470740125.ch21
https://doi.org/10.1002/9780470740125.ch21
Publikováno v:
More than Moore ISBN: 9780387755922
This chapter gives an overview of assembly and packaging technologies that allow heterogeneous system integration for RF applications
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bd2d5efbaa235c922103aba2cccad64
https://doi.org/10.1007/978-0-387-75593-9_3
https://doi.org/10.1007/978-0-387-75593-9_3
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
Modern commercial telecommunication devices tend to integrate more and more functionality on a single chip, the so called SoC (System on a Chip) approach. This results in ultra-compact and low cost realization. However antenna filters and diplexer ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::743c19eb4d7544eb686d90717ef79480
https://doi.org/10.1109/eptc.2008.4763444
https://doi.org/10.1109/eptc.2008.4763444
Publikováno v:
2008 58th Electronic Components and Technology Conference.
In this paper we present the integration of high-quality passive components and circuits within a thin-film technology on high-resistivity silicon. 100 mum thick wafers are used, allowing the integration of though-silicon vias with a diameter of 100
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ebf8ca64545bfb19b3ae1e4e0ad94b6f
https://doi.org/10.1109/ectc.2008.4550268
https://doi.org/10.1109/ectc.2008.4550268
Publikováno v:
2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.
Millimeter-wave commercial communication systems are getting a lot of attention in the recent years, and therefore there is a need of implementing miniaturized high-quality passive components at these frequencies. In this paper, we demonstrate the in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::060022f31b37ba303b30701ecd16a14f
https://doi.org/10.1109/smic.2008.41
https://doi.org/10.1109/smic.2008.41