Zobrazeno 1 - 10
of 106
pro vyhledávání: '"G Karayiannis"'
Autor:
null Amirah Mohamad Sahar, null Mohamad Shaiful Ashrul Ishak, null Jan Wissink, null Mohamed M. Mahmoud, null Tassos G. Karayiannis
Copyright © 2023 The authors. This study proposed newly designed inlet manifolds to manage non-uniformity in parallel multi microchannel heat sink by introducing edges with a curved shape were introduced in order to reduce flow-recirculation at the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f114f21ad830a4de4c2a6cbc56ad3468
https://bura.brunel.ac.uk/handle/2438/26136
https://bura.brunel.ac.uk/handle/2438/26136
Autor:
Y. Y. Yan, Tassos G. Karayiannis, Michael W. Collins, P. H. G. Allen, R. S. Neve, R. K. Al-Dadah
Publikováno v:
Proceeding of Energy and Environment, 1995.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1fc282b1132758abb04f0015e2dd16a
https://doi.org/10.1615/1-56700-052-5.550
https://doi.org/10.1615/1-56700-052-5.550
Copyright © 2022 The Authors. The substrate material and active side characteristics can affect the bubble ebullition cycle and consequently the heat transfer rate and pressure drop in microchannel evaporators. This paper presents an experimental st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e7c1f483e30e6c0b15075afa793c7806
https://bura.brunel.ac.uk/handle/2438/24667
https://bura.brunel.ac.uk/handle/2438/24667
This article presents the analysis of an empirical study that explored the political discourse of the Church of Greece (CoG) during a specific period of the Greek financial crisis, that is, from January 2015 to January 2019. The analysis is based on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______2127::9547026deba7de243f2d61c17a2b2b99
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:3219690
https://pergamos.lib.uoa.gr/uoa/dl/object/uoadl:3219690
Copyright © 2022 The Author(s). This study presents the single-phase heat transfer and pressure drop characteristics of R1233zd(e) in a Brazed Plate Heat Exchanger (BPHE). Experiments on single-phase, water-to-water, were initially conducted and a c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::772161d56c51d9f61b74d54080ddd7d5
https://bura.brunel.ac.uk/handle/2438/23711
https://bura.brunel.ac.uk/handle/2438/23711
Flow boiling heat transfer enhancement using porous coatings in microchannels has been experimentally investigated with HFE-7200. Results of the coated microchannel heat sink were compared to baseline results in a plain, micro-milled copper microchan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f32d6da74057f026da1d59445510cb50
https://bura.brunel.ac.uk/handle/2438/23380
https://bura.brunel.ac.uk/handle/2438/23380
Autor:
M.M. Mahmoud, Tassos G. Karayiannis
Copyright © 2021 The Author(s). The pool boiling process is one of the most effective heat transfer modes capable of transferring large amounts of heat with small temperature difference between the heated surface and the fluid. In addition, fundamen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::df790170d7482e6c42f74453436c0810
https://bura.brunel.ac.uk/handle/2438/23029
https://bura.brunel.ac.uk/handle/2438/23029
Autor:
Neima Brauner, Tassos G. Karayiannis
Publikováno v:
Heat Transfer Engineering. 42:453-455
The 6th Micro and Nano Flows Conference was held at the Georgia Institute of Technology, Atlanta, Georgia, USA, between 9-12 of September 2018, see http://mnf2018.com. The conference Local Organizi...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cce64e481da28ec1d7913c91e5ae4fb9
https://doi.org/10.1080/01457632.2019.1707370
https://doi.org/10.1080/01457632.2019.1707370
Publikováno v:
Advances in Heat Transfer and Thermal Engineering ISBN: 9789813347649
Miniaturised electronics pose challenging thermal demands, not only at chip-level power dissipation but also at the complete system-level heat rejection, in modern electronic packages. Chip-level power densities are projected to be as high as 4.5 MW/
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cbec610d75cadd92ed9d37d12178c2f8
https://doi.org/10.1007/978-981-33-4765-6_15
https://doi.org/10.1007/978-981-33-4765-6_15