Zobrazeno 1 - 10
of 29
pro vyhledávání: '"Gökhan Perçin"'
Autor:
G.G. Yaralioglu, Sanli Ergun, Utkan Demirci, Gökhan Perçin, Butrus T. Khuri-Yakub, Edward Hæggström
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 17:517-524
We propose using two-dimensional (2-D) micromachined droplet ejector arrays for environmentally benign deposition of photoresist and other spin-on materials, such as low-k and high-k dielectrics used in IC manufacturing. Direct deposition of these ch
Autor:
Gökhan Perçin, Butrus T. Khuri-Yakub
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 16:452-459
A technique for resist deposition using a novel fluid ejection method is presented in this paper. An ejector has been developed to deposit photoresist on silicon wafers without spinning. Drop-on-demand coating of the wafer reduces waste and the cost
Autor:
Gökhan Perçin, Butrus T. Khuri-Yakub
Publikováno v:
Review of Scientific Instruments. 74:1120-1127
In this article, we present a technique for the deposition of inks, organic polymers, and solid particles, using a fluid ejector. The ejector design is based on a flextensional transducer that excites axisymmetric resonant modes in a clamped circular
Autor:
Butrus T. Khuri-Yakub, Gökhan Perçin
Publikováno v:
Review of Scientific Instruments. 73:2193-2196
In this article, we present a variation on the design of the micromachined flextensional transducer for use to eject liquids. The transducer is constructed by depositing a piezoelectric thin film to a thin, edge clamped, circular annular plate. By pl
Publikováno v:
SPIE Proceedings.
This paper discusses a novel pattern based standalone process verification technique that meets with current and future needs for semiconductor manufacturing of memory and logic devices. The choosing the right process verification technique is essent
Publikováno v:
Extreme Ultraviolet (EUV) Lithography IV.
Extreme ultra-violet (EUV) lithography has been planned for high-volume manufacturing (HVM) in 2014 for critical layers of advanced nodes in the semiconductor industry. Process and proximity correction (PPC) and verification is necessary in order to
Autor:
Jesus Carrero, Gökhan Perçin
Publikováno v:
SPIE Proceedings.
As the semiconductor industry is moving to very low-k1 patterning solutions, the metrology problems facing process engineers are becoming much more complex. Choosing the right optical critical dimension (OCD) metrology technique is essential for brid
Autor:
Jesus Carrero, Alan Zhu, Katsuyuki Miyoko, Yoshimitsu Okuda, Gökhan Perçin, Apo Sezginer, Kiyoshi Kageyama, Anwei Liu
Publikováno v:
SPIE Proceedings.
In recent years, mask critical dimension (CD) linearity and uniformity has become increasingly important. The ITRS roadmap shows the mask CD control requirements exceeding those of the wafer side beyond the 45nm node. Measurements show that there are
Publikováno v:
Applied Physics Letters. 73:2375-2377
In this letter, we present a technique for the deposition of inks, organic polymers and solid particles, using a fluid ejector. The ejector design is based on a flextensional transducer that excites axisymmetric resonant modes in a clamped circular m
Publikováno v:
Applied Physics Letters
This letter presents micromachined two-dimensional array flextensional transducers that can be used to generate sound in air or water. Individual array elements consist of a thin piezoelectric ring and a thin, fully supported, circular membrane. We r