Assessment of a Heat Spreading Solution for Hot Spots Cooling in Compact Packages

Autor: Yvan Avenas, Perceval Coudrain, G. Belly, Jean-Philippe Colonna, Severine Cheramy, F. de Crecy, R. Prieto

Publikováno v: International Workshop on Thermal Investigations of IC´S and Systems (THERMINIC 2014)
International Workshop on Thermal Investigations of IC´S and Systems (THERMINIC 2014), Sep 2014, Londres, United Kingdom

Heat generation in integrated circuits has become in few decades one of the most limiting factors for performance improvement in mobile device components, such as cell phones or tablets. In these devices, heat dissipation is limited to a few Watts as

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6e2164b88c6313dfd665826e68d6ac77
https://hal.archives-ouvertes.fr/hal-01084456

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