Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Fumiyoshi Kawashiro"'
Autor:
Fumiyoshi KAWASHIRO, Masaaki YOSHIKAWA, Eitaro MIYAKE, Yoshiki ENDO, Tatsuo TONEDACHI, Hiroshi NISHIKAWA
Publikováno v:
Journal of Smart Processing. 11:71-77
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4bd2300fea2b7381bf5b9dd077e16418
https://doi.org/10.7791/jspmee.11.71
https://doi.org/10.7791/jspmee.11.71
Autor:
Kentaro Takao, Eitaro Miyake, Tatsuya Kobayashi, Fumiyoshi Kawashiro, Masaaki Yoshikawa, Hiroshi Nishikawa, Yoshiki Endo, Tatsuo Tonedachi
Publikováno v:
Microelectronics Reliability. 99:168-176
Recently, there have been moves to replace Si power devices with SiC ones, which will require new materials with higher thermal conductivity for power module assemblies owing to their higher operating temperatures. Al wire bond interconnections suffe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::faad013a35f2723a07b26abd91aa6d7b
https://doi.org/10.1016/j.microrel.2019.04.016
https://doi.org/10.1016/j.microrel.2019.04.016
Autor:
Omid Mokhtari, Fumiyoshi Kawashiro, Takehiko Maeda, Satoshi Itoh, Takaki Eto, Hiroshi Nishikawa, Min-Su Kim, Tetsuya Hirose
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 7:1-7
Wire bonding is a key technique for electrical interconnections between integrated circuit (IC) and the metal frame or printed circuit board (PCB). One of the most common wire bonding system is bonding of the Au wire to Al metallization, however, Cu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e707e3be927918506965beb33e25c93c
https://doi.org/10.5104/jiepeng.7.1
https://doi.org/10.5104/jiepeng.7.1
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
Recently, there have been many developments on power devices to improve their functions. Especially, the junction temperature of power modules that equip SiC (Silicon Carbide) chips will be higher than 200 °C as current densities are too high, and n
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a26489867278d6032d0abc8c67001f8b
https://doi.org/10.1109/icep.2016.7486851
https://doi.org/10.1109/icep.2016.7486851
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 2:62-68
In this study, 60 solder compositions were examined in an effort to improve the integrity against impact loads of the solder joints on an electroless Ni–P/Au surface finish. The Ag, Cu, and Ni contents in the Sn-based solder varied from 0 to 4.5 wt
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea8f50cb3b1f792fb89a81d5e2d9f2eb
https://doi.org/10.5104/jiepeng.2.62
https://doi.org/10.5104/jiepeng.2.62
Autor:
Takaki Eto, Fumiyoshi Kawashiro, Takehiko Maeda, Tetsuya Hirose, Min-Su Kim, Hiroshi Nishikawa, Satoshi Itou, Omid Mokhtari
Publikováno v:
2014 International Conference on Electronics Packaging (ICEP).
This research focuses on the formation and growth behavior of Cu/Al intermetallic compounds (IMCs). In order to investigate IMC growth after 30, 60 and 120 min of aging at 270, 300 and 330 °C, cross-section of Al, Cu and Cu/Al IMCs were examined by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::23eb0d7f7e738dd5c55e92018d6d2d90
https://doi.org/10.1109/icep.2014.6826679
https://doi.org/10.1109/icep.2014.6826679
Autor:
Tadashi Yamamoto, Toshiyuki Fujii, Takafumi Hirata, Fumiyoshi Kawashiro, Yoshihisa Maeda, Kazushige Nishizawa
Publikováno v:
Separation Science and Technology. 33:2101-2112
The isotope effect of zinc in the chemical exchange reaction using a macrocyclic ligand was not found to be ruled by the Bigeleisen-Mayer approximation, which suggested that the enrichment factor is proportional to the mass difference and is inversel
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ae174b927d5329ca2880fb4d4ff1a14
https://doi.org/10.1080/01496399808545717
https://doi.org/10.1080/01496399808545717
Autor:
Hiroaki Kobayashi, Koujirou Shibuya, Norikazu Motohashi, Masaya Kawano, Fumiyoshi Kawashiro, Kimura Takehiro, Yoichiro Kurita
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
We have developed a new Fan-Out Wafer-Level Packaging (FO-WLP) technology with flexible design capabilities for multilayer fan-out redistribution layers (RDLs) connected to the fine-pitch I/O pads of chips. The prototype of a 2.0 mm × 2.0 mm FO-WLP
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f0a4221ba6b5a7559bb93d42c796f21
https://doi.org/10.1109/estc.2010.5642888
https://doi.org/10.1109/estc.2010.5642888
Autor:
Tetsuya Hirose, Satoshi Itoh, Akira Yajima, Takaki Etoh, Hiroshi Nishikawa, Takehiko Maeda, Fumiyoshi Kawashiro
Publikováno v:
Japanese Journal of Applied Physics. 54:05EC01
Wire bonding technology is used in most semiconductor products. Recently, high gold prices have forced semiconductor manufacturers to replace Au wires with Cu wires. Because Cu wire bonds are vulnerable to high temperature and humidity, they remain u
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::05564d38baf8d5f7935c83b2ee18de60
https://doi.org/10.7567/jjap.54.05ec01
https://doi.org/10.7567/jjap.54.05ec01
Autor:
Fumiyoshi Kawashiro, Satoshi Itoh, Takehiko Maeda, Tetsuya Hirose, Akira Yajima, Takaki Etoh, Hiroshi Nishikawa
Publikováno v:
Japanese Journal of Applied Physics; May2015, Vol. 54 Issue 5S, p1-1, 1p