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pro vyhledávání: '"Fukuya Naohito"'
Autor:
Rao Tummala, Fuhan Liu, Mohanalingam Kathaperumal, Atsushi Kubo, Naoki Watanabe, Atom Watanabe, Cheng Ping Lin, Pratik Nimbalkar, David Weyers, Madhavan Swaminathan, Fukuya Naohito, Toshiyuki Makita
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Low-stress and low-warpage dielectrics are gaining importance as we move towards large-body Multi-chip Modules (MCMs). This paper demonstrates fabrication of redistribution layer (RDL) with 5 μm linewidth/spacing using a novel low-stress dielectric
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af8d49ccfccadc014500ed5c14365a68
https://doi.org/10.1109/ectc32862.2020.00023
https://doi.org/10.1109/ectc32862.2020.00023
