Zobrazeno 1 - 10
of 61
pro vyhledávání: '"Fubin Song"'
Publikováno v:
The Journal of Organic Chemistry. 88:3353-3358
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e626923a0463735a5d9d48e3a28364b
https://doi.org/10.1021/acs.joc.3c00210
https://doi.org/10.1021/acs.joc.3c00210
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e4a0a7a79c41de58ad2f99640825f4c3
https://doi.org/10.1109/eptc56328.2022.10013150
https://doi.org/10.1109/eptc56328.2022.10013150
Publikováno v:
Microelectronics Reliability. 54:435-446
Cu 6 Sn 5 and Cu 3 Sn are common intermetallic compounds (IMCs) found in Sn–Ag–Cu (SAC) lead-free solder joints with OSP pad finish. People typically attributed the brittle failure to excessive growth of IMCs at the interface between the solder j
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f89bf018424b33156a51a7a216b5a3ea
https://doi.org/10.1016/j.microrel.2013.10.005
https://doi.org/10.1016/j.microrel.2013.10.005
Publikováno v:
Structural Dynamics of Electronic and Photonic Systems
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e57b459de68624650ce82212d0b51a93
https://doi.org/10.1002/9780470950012.ch10
https://doi.org/10.1002/9780470950012.ch10
Publikováno v:
Scopus-Elsevier
The enforcement of environmental legislation is pushing electronic products to take lead-free solder alloys as the substitute of traditional lead-tin solder alloys. Applications of such alloys require a better understanding of their mechanical behavi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::28b4aff035b03b5f97ac0308a86b672a
https://doi.org/10.4071/isom-2010-tp4-paper5
https://doi.org/10.4071/isom-2010-tp4-paper5
Publikováno v:
Journal of Electronic Packaging. 136
SnCuNi is one of the most common ternary intermetallic compounds formed in the Sn-based solder joint, and its formation and properties can be greatly influenced by the amount of Ni. Ni can participate in the interfacial reaction and diffuse into the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4e9f9f8c44cbd9eabe286c9dbcee1c9
https://doi.org/10.1115/1.4025915
https://doi.org/10.1115/1.4025915
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
Hot pin pull test is frequently used for the pad crater evaluation. Although it carries several merits, it still has certain drawbacks such as time consuming and causing potential thermal impact on the PCB during the pin attachment process. In this p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f84d24cf65926392445f2f3a4cb440d
https://doi.org/10.1109/ectc.2013.6575818
https://doi.org/10.1109/ectc.2013.6575818
Publikováno v:
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
With the advancement of the motherboard multiple functions, more and more connectors are mounted on the Printed Circuit Board (PCB) to interconnect electronic components or sub-functional daughtercards. Among different types of connectors, Straddle M
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb34bb9c4e6fc35c08bdf18bcb0ebe7b
https://doi.org/10.1109/emap.2012.6507912
https://doi.org/10.1109/emap.2012.6507912
Publikováno v:
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
Hot pin pull test is one of the testing methods frequently used in the pad crater evaluation. Although it carries several merits comparing with the other testing methods, it still has certain drawbacks such as time consuming and the potential thermal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f374aa33bd4dd56ba39ddff9a0cd20a
https://doi.org/10.1109/emap.2012.6507880
https://doi.org/10.1109/emap.2012.6507880