Zobrazeno 1 - 10
of 31
pro vyhledávání: '"Fu-Wei Chen"'
Autor:
Shi-Jun Wang, Zhen-Zhen Qiu, Fu-Wei Chen, An-Li Mao, Jun-Chao Bai, Ye-Jing Hong, Zhong-Pan Zhang, Wu-An Zhu, Zhi-Wei Zhang, Hao Zhou
Publikováno v:
Cell Death and Disease, Vol 13, Iss 6, Pp 1-10 (2022)
Abstract Recent studies have investigated the ability of extracellular vesicles (EVs) in regulating neighboring cells by transferring signaling molecules, such as microRNAs (miRs) in renal fibrosis. EVs released by bone marrow mesenchymal stem cells
Externí odkaz:
https://doaj.org/article/88c5e5cba8b64defa02fa0e9c2621d81
Autor:
Fu-Wei Chen, 陳福維
98
CAPTCHA (Completely Automated Public Turing Test to Tell Computers and Humans Apart) is a type of reverse Turing test that distinguishes between computers and humans by employing challenge-response tests that most humans can pass easily, but
CAPTCHA (Completely Automated Public Turing Test to Tell Computers and Humans Apart) is a type of reverse Turing test that distinguishes between computers and humans by employing challenge-response tests that most humans can pass easily, but
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/00249929650644551495
Autor:
Fu-Wei Chen, 陳福偉
96
To achieve minimum signal propagation delay, the non-uniform wire width routing architecture has been widely used in modern VLSI design. The non-uniform routing architecture exploits the wire width flexibilities to trade area for performance.
To achieve minimum signal propagation delay, the non-uniform wire width routing architecture has been widely used in modern VLSI design. The non-uniform routing architecture exploits the wire width flexibilities to trade area for performance.
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/85109259800246850519
Autor:
Fu-Wei Chen, 陳富偉
91
This work is mainly devoted to the study of the heat dissipation of the power amplifier for radio frequence. The package of the power amplifier of radio frequence is of the multi-chips modules-deposited (MCM-D), whose chip is welded on the su
This work is mainly devoted to the study of the heat dissipation of the power amplifier for radio frequence. The package of the power amplifier of radio frequence is of the multi-chips modules-deposited (MCM-D), whose chip is welded on the su
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/21555189240535459326
Autor:
Shi-Jun Wang, Zhen-Zhen Qiu, Fu-Wei Chen, An-Li Mao, Jun-Chao Bai, Ye-Jing Hong, Zhong-Pan Zhang, Wu-An Zhu, Zhi-Wei Zhang, Hao Zhou
Publikováno v:
Cell deathdisease. 13(6)
Recent studies have investigated the ability of extracellular vesicles (EVs) in regulating neighboring cells by transferring signaling molecules, such as microRNAs (miRs) in renal fibrosis. EVs released by bone marrow mesenchymal stem cells (BMSCs) c
Publikováno v:
SoCC
3D integration is one of the promising technologies to alleviate interconnection delay. Implementing 3D IC is to integrate 2D ICs with Through-Silicon Vias (TSVs). For yield consideration, TSVs are bundled together as a TSV block [1]. Regrettably, th
Publikováno v:
Applied Mechanics and Materials. :3743-3746
For quantitative analysis of impact of grounding capacitance on the traction power supply system, in this paper, two wires system as an example with the mirror image method concluded the calculation formula of two wires system to ground capacitance a
Autor:
Fu-Wei Chen, Tingting Hwang
Publikováno v:
ACM Journal on Emerging Technologies in Computing Systems. 10:1-22
IP reuse methodology has been used extensively in SoC (system-on-chip) design. In this reuse methodology, while design and implementation costs are saved, manufacturing cost is not. To further reduce the cost, this reuse concept has been proposed at
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 20:2255-2264
To guarantee that an application-specific integrated circuit (ASIC) meets its timing requirement, at-speed scan testing becomes an indispensable procedure for verifying the performance of ASIC. However, at-speed scan test suffers the test-induced yie
Autor:
Fu-Wei Chen, Yi-Yu Liu
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 29:2046-2050
In recent years, structured application-specific integrated circuit (ASIC) design style has lessened the importance of mask cost. Multiple structured ASIC chip designs share the same pre-fabricated device and wire masks. Nevertheless, the interconnec