Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Fu, Haley"'
Publikováno v:
SMT007 Magazine. Sep2024, Vol. 39 Issue 9, p72-84. 10p.
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP); 2016, p99-104, 6p
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP); 2016, p89-93, 5p
Publikováno v:
2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials & Packaging (EMAP) Conference; 2016, p1-8, 8p
Publikováno v:
2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC); 2015, p233-238, 6p
Publikováno v:
2015 IEEE 17th Electronics Packaging & Technology Conference (EPTC); 1/1/2015, p1-5, 5p
Autor:
Fu, Haley, Lee, Dem, Lee, Jeffrey, Tong, Geoffrey, Lee, Simon, Singh, Prabjit, Kazi, Aamir, Nailos, Mary, Ables, Wallace, Guo, Karlos, Jiang, GuoDong
Publikováno v:
2015 10th International Microsystems, Packaging, Assembly & Circuits Technology Conference (IMPACT); 2015, p124-129, 6p
Autor:
Fu, Haley
Publikováno v:
36th International Electronics Manufacturing Technology Conference; 2014, p1-5, 5p
Autor:
Narita, Izuru, Fishbune, Rick, Malik, Randhir, Mohr, David, Chandra, Harish, Schaffer, Mark, Fu, Haley
Publikováno v:
2014 International Conference on Electronics Packaging (ICEP); 2014, p193-196, 4p
Publikováno v:
2014 International Conference on Electronics Packaging (ICEP); 2014, p197-201, 5p