Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Friedemann Voelklein"'
Edited by the initiators of a priority research program funded by the German Science Foundation and written by an international team of key players, this is the first book to provide an overview of nanostructured thermoelectric materials -- putting t
Publikováno v:
Sensors and Actuators B: Chemical. 158:286-291
Within the last decade there has been a great increase in the need of trace and ultra-trace explosive detection. In this report, we demonstrate a new and versatile type of chemical explosive sensors based on metal oxide nanotubes easily made, even wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1bd2d85067028866baa843ef43fb065
https://doi.org/10.1016/j.snb.2011.06.020
https://doi.org/10.1016/j.snb.2011.06.020
Publikováno v:
Microelectronics Reliability. 48:1513-1516
An alternative method for exposing IC structures in stacked die packages is described in this paper. Conventional preparation of stacked die packages is complex and time-consuming, requiring costly equipment and experienced operators. This paper pres
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12c7831f08597a79091ae0005d79210e
https://doi.org/10.1016/j.microrel.2008.06.033
https://doi.org/10.1016/j.microrel.2008.06.033
Publikováno v:
Nanowires-Implementations and Applications
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ba03d11baec64d77df35c2734bcbfb06
http://www.intechopen.com/articles/show/title/characterization-and-application-of-thermoelectric-nanowires
http://www.intechopen.com/articles/show/title/characterization-and-application-of-thermoelectric-nanowires
Publikováno v:
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
The trends of 3D integration and System-in-Package (SiP) require the adaptation of target preparation methods for failure analysis of these complex integrated devices. Recent improvements in laser-based target preparation make laser cross-sections th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::130e0faff408c26c910c4ada9e72b27d
https://doi.org/10.1109/esime.2010.5464586
https://doi.org/10.1109/esime.2010.5464586
Autor:
Stefan Martens, Frédéric Courtade, Juergen Wilde, Friedemann Voelklein, Walter Mack, Philippe Perdu
Publikováno v:
Journal of Electronic Packaging. 131
The trend toward 3D integration in electronic packaging requires that failure analysis procedures and target preparation methods are adapted from conventional discrete packages to these emerging packaging technologies. This paper addresses the feasib
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a2a4668d2977fb6eabd4b0545e136b69
https://doi.org/10.1115/1.3144157
https://doi.org/10.1115/1.3144157
Conference
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Conference
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