Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Frida Liang"'
Autor:
Damon Tsai, Jeffrey Mileham, Sean Lee, Frida Liang, M T Lee, Maddux Chen, David M. Owen, T H Chen
Publikováno v:
2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
As chip makers move to advanced nodes and device geometries shrink, design and production costs have risen rapidly. As a result, it has become increasingly critical to reduce costs in established technology nodes by increasing device yield. For a giv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08ad6505bbb7044d5554d213ddee0be6
https://doi.org/10.1109/asmc.2017.7969193
https://doi.org/10.1109/asmc.2017.7969193
Autor:
Sean Lee, Jeffrey Mileham, C. F. Hua, Sungtae Kim, Ming Sheng Wei, Eric Bouche, Damon Tsai, Frida Liang, Albert Huang
Publikováno v:
SPIE Proceedings.
As device shrink, there are many difficulties with process integration and device yield. Lithography process control is expected to be a major challenge due to tighter overlay and focus control requirement. The understanding and control of stresses a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::26818b3474bd970d9eb4c4f660514058
https://doi.org/10.1117/12.2257799
https://doi.org/10.1117/12.2257799
Autor:
Remco Dirks, Ethan Chiu, Henk Niesing, Baukje Wisse, Stefan Geerte Kruijswijk, Reinder Teun Plug, Bijoy Rajasekharan, Mariya Ponomarenko, Sylvia Yuan, Marlene Strobl, Platt Hung, Noelle Wright, Wilhelm Tsai, Vincent Couraudon, David Huang, Thomas M. Chen, Henry Chen, Paul K. L. Yu, Yi Song, Frida Liang, Andy Lan, Alan Wang, Wilson Hsu, Hugo Augustinus Joseph Cramer
Publikováno v:
Metrology, Inspection, and Process Control for Microlithography XXVIII.
Integrated metrology in the lithography cluster is a promising solution to tighten process control. It is shown that optical CD metrology using YieldStar, an angular resolved scatterometer, meets all requirements in terms of precision, process robust
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8494e48a6e6ed8de43718353dbe049e0
https://doi.org/10.1117/12.2047205
https://doi.org/10.1117/12.2047205
Autor:
Jon Wu, Christophe Fouquet, Guo-Tsai Huang, T. S. Gau, Henk-Jan H. Smilde, Stephen P. Morgan, Maurits van der Schaar, Y. C. Ku, Cathy Wang, Miranda Un, Murat Bozkurt, Andreas Fuchs, Kai-Hsiung Chen, Steffen Meyer, Vincent Tsai, Kaustuve Bhattacharyya, Martin Jacobus Johan Jak, Peter Ten Berge, Michael Kubis, L. G. Terng, Mark van Schijndel, David Hwang, Chih-Ming Ke, Arie Jeffrey Den Boef, Frida Liang, Kevin Cheng
Publikováno v:
SPIE Proceedings.
Aggressive on-product overlay requirements in advanced nodes are setting a superior challenge for the semiconductor industry. This forces the industry to look beyond the traditional way-of-working and invest in several new technologies. Integrated me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5e0a8bd347e041751b5b3f6cdef44fa7
https://doi.org/10.1117/12.2011878
https://doi.org/10.1117/12.2011878