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pro vyhledávání: '"Frederic Pitard"'
Autor:
Gregoire Ducotey, Olivier Robin, Sebastien Gaillard, Damien Jeanjean, Rurh Sramek, Yufei Chen, Brian J. Brown, Frederic Pitard, Laurent Nicoud, Sébastien Mermoz
Publikováno v:
2015 26th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
A high yield copper damascene process requires defect-free copper surfaces after Cu CMP. In this paper we present a novel technique to improve cleaning efficiency, especially the removal of particles in the range of 20 to 80nm. This innovative Chemic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e44b23096511b2a262c3620ab4db31e4
https://doi.org/10.1109/asmc.2015.7164440
https://doi.org/10.1109/asmc.2015.7164440
