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pro vyhledávání: '"Freddie Furrer"'
Autor:
Appo van der Wiel, Tessa ten Cate, Bart van de Vorst, Jan-Willem Burssens, Anton Aulbers, Freddie Furrer, Ben van der Zon, Jian Chen, Hessel Maalderink, Mark Vaes
Publikováno v:
2012 4th Electronic System-Integration Technology Conference.
Packaging of semiconductor chips, especially MEMS-based, always causes stress on the functional areas of the die causing unpredictable changes in chip performance. As a consequence such devices can only be calibrated individually after complete assem
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a14307a4986cdc8f75ebb29aaff2d93a
https://doi.org/10.1109/estc.2012.6542066
https://doi.org/10.1109/estc.2012.6542066
