Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Franz Xaver Hutter"'
Autor:
Rares-George Scurtu, Joachim N. Burghartz, Fida Saidani, Wolfgang Braunwarth, Franz Xaver Hutter
Publikováno v:
Advances in Radio Science, Vol 15, Pp 83-91 (2017)
In this work, various Lithium-ion (Li-ion) battery models are evaluated according to their accuracy, complexity and physical interpretability. An initial classification into physical, empirical and abstract models is introduced. Also known as white,
Publikováno v:
2017 IEEE International Systems Engineering Symposium (ISSE).
This paper presents a demonstrator of a Lithiumion battery for automotive applications. A printed circuit board consisting of sensors, local memory elements, a digital signal processing unit and a communication interface is integrated into a Lithium-
Autor:
Heinz-Gerd Graf, Franz Xaver Hutter, Uwe Schmidt, Joachim N. Burghartz, Markus B. Schubert, Markus Nicke, Jan Dirk Schulze Spuentrup, Juergen Sterzel, Christine Harendt
Publikováno v:
Sensors (Basel, Switzerland)
Sensors
Volume 8
Issue 10
Pages: 6340-6354
Sensors, Vol 8, Iss 10, Pp 6340-6354 (2008)
Sensors
Volume 8
Issue 10
Pages: 6340-6354
Sensors, Vol 8, Iss 10, Pp 6340-6354 (2008)
A 664 x 664 element Active Pixel image Sensor (APS) with integrated analog signal processing, full frame synchronous shutter and random access for applications in star sensors is presented and discussed. A thick vertical diode array in Thin Film on C
Publikováno v:
SPIE Proceedings.
Extraordinary/Enhanced optical transmission (EOT) is studied in the realization of plasmonic based filters in the visible range and near infrared spectrum for the purpose of substituting the Bayer-pattern filter with a new CMOS-compatible filter whic
Autor:
David Borowsky, Ingo Herrmann, Christoph Schelling, Shen Hue Sun, Daniel B. Etter, Franz Xaver Hutter, Joachim N. Burghartz, Fabian Utermohlen
Publikováno v:
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS).
We present a scalable low-cost microbolometer technology platform which is based on separate fabrication of MEMS and read-out ASIC CMOS wafers. Mechanical, electrical and hermetical connection is achieved by Cu-based thermocompression bonding. The pe
Autor:
Shen Hue Sun, Ingo Herrmann, Joachim N. Burghartz, Daniel B. Etter, Franz Xaver Hutter, Fabian Utermohlen
Publikováno v:
2013 International Semiconductor Conference Dresden - Grenoble (ISCDG).
A fabrication process for a thermo-diode microbolometer array is presented. The process is based on a sintered porous silicon (sPS) technique adopted from Chipfilm™ technology to enable vertical thermal insulation of the pixels. In addition, the pr
Publikováno v:
2012 IEEE 25th International Conference on Micro Electro Mechanical Systems (MEMS).
This paper reports about the development of a low-cost, CMOS compatible process technology to create thermally insulated pixel regions for integrated microbolometers. The enabling technology is based on a modified sintered porous silicon (sPS) techni
Autor:
Markus Strobel, Franz Xaver Hutter, Daniel Brosch, Heinz-Gerd Graf, Wolfram Klingler, Joachim N. Burghartz
Publikováno v:
ISSCC
Challenges in the design of solid-state imagers for industrial measurement and control include: high image resolution, wide temperature range, adequate temperature resolution, high measurement speed, thermal stability of the sensor chip, and most imp
Publikováno v:
Optical Sensors 2008.
HDRC (high dynamic range CMOS) allows for more than 120 dB signal range in image processing. Scene details with both very high and extremely low radiant flux may thus appear within the same image. Color constancy over the entire signal range and good