Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Fransisca Sudargho"'
Autor:
Fransisca Sudargho, Ara Philipossian, Carolyn F. Graverson, Katherine M. Wortman-Otto, Yasa Sampurno, Jason J. Keleher, Sian Theng
Publikováno v:
Solid State Phenomena. 314:264-269
We have shown how different micellar (SDBS) vs. polyelectrolytic (PSSA) supramolecular assemblies in post-CMP cleaning solutions differ in their tribological performance when used in a novel PVA scrubber for 300-mm silicon dioxide wafer cleaning. Sig
Autor:
Yasa Sampurno, Leticia Vazquez Bengochea, Fransisca Sudargho, Ruochen Han, Calliandra Stuffle, Ara Philipossian
Publikováno v:
ECS Journal of Solid State Science and Technology. 7:P253-P259
Publikováno v:
ECS Journal of Solid State Science and Technology. 6:P161-P164
Publikováno v:
ECS Journal of Solid State Science and Technology. 6:P32-P37
In chemical mechanical planarization (CMP), Stribeck curves are normally constructed by plotting average coefficient of frictions (COF) against the average Sommerfeld number. Consequently, traditional Stribeck curves fail to provide a full explanatio
Autor:
Adam Rice, Yasa Sampurno, Yun Zhuang, Fransisca Sudargho, Christopher Wargo, Xiaoyan Liao, Ara Philipossian
Publikováno v:
Microelectronic Engineering. 98:70-73
The effect of retaining ring slot design and polishing conditions on slurry flow dynamics at the bow wave was investigated. An ultraviolet enhanced fluorescence technique was employed to measure the slurry film thickness at the bow wave for two polye
Autor:
Hiroyuki Morishima, Yun Zhuang, Toranosuke Ashizawa, Yasa Sampurno, Fransisca Sudargho, Ara Philipossian
Publikováno v:
Microelectronic Engineering. 88:2857-2861
This study explores the transition of force spectral fingerprints of shallow trench isolation chemical mechanical planarization during early evolution of wafer topography and layer transition from silicon dioxide to silicon nitride. Polishing was don
Publikováno v:
ECS Transactions. 34:659-663
In this study, the effect of slurry application/injection methods and polishing conditions on slurry flow dynamics at the retaining ring bow wave was investigated. Two slurry application/injection methods (standard slurry application method and novel
Publikováno v:
ECS Transactions. 27:645-650
This paper presents an accurate, consistent and rapid novel method for determining the dry coefficient of friction of conditioner discs. The first part of the study dealt with characterizing 3 diamond discs (i.e. two 'known good' and one 'known bad'
Autor:
Sian Theng, Xun Gu, Tadahiro Ohmi, Yun Zhuang, Fransisca Sudargho, Takenao Nemoto, Ara Philipossian, Ting Sun, Yasa Sampurno, Akinobu Teramoto
Publikováno v:
Solid State Phenomena. :363-366
Brush scrubbing has been widely used in post chemical mechanical planarization (CMP) applications to remove contaminations, such as slurry residues and particles, from the wafer surface. During brush scrubbing, particle removal results from direct co
Publikováno v:
Journal of Global Optimization. 38:181-199
We examine the problem of building or fortifying a network to defend against enemy attacks in various scenarios. In particular, we examine the case in which an enemy can destroy any portion of any arc that a designer constructs on the network, subjec