Zobrazeno 1 - 10
of 41
pro vyhledávání: '"Frankie Liu"'
Autor:
Hiren D. Thacker, Pranay Koka, H. Schwetman, Xuezhe Zheng, Frankie Liu, P. Amberg, Ashok V. Krishnamoorthy, Jon Lexau, J. E. Cunningham, Ivan Shubin, Elizabeth Chang, Guoliang Li, Ron Ho
Publikováno v:
IEEE Micro. 33:68-78
Optical interconnects play an integral role in large-scale digital computing, switching, and routing systems. The authors describe a path toward future many-chip modules based on silicon photonic interposers that stitch together tens of chips in a de
Publikováno v:
ASYNC
A frequency-locked loop (FLL) system typically employs synchronous digital counters to estimate the frequency discrepancy between the output of a local oscillator and an external reference clock. We present a novel FIFO-based frequency detector as an
Autor:
Dinesh Patil, Jon Lexau, Xuezhe Zheng, Frankie Liu, Elad Alon, Hesam Fathi Moghadam, John E. Cunningham, Philip Amberg, Jon Gainsley, Ron Ho, Ashok V. Krishnamoorthy, Michael Dayringer
Publikováno v:
IEEE Journal of Solid-State Circuits. 47:2049-2067
We describe transmitter and receiver circuits for a 10-Gbps single-ended optical link in a 40-nm CMOS technology. The circuits are bonded using low-parasitic micro-solder bumps to silicon photonic devices on a 130-nm SOI platform. The transmitter dri
Autor:
Jin Yao, J. E. Cunningham, Hiren D. Thacker, Jon Lexau, Dinesh Patil, Ashok V. Krishnamoorthy, Kannan Raj, Guoliang Li, Ivan Shubin, Ron Ho, Ying Luo, Xuezhe Zheng, Frankie Liu
Publikováno v:
Journal of Lightwave Technology. 30:641-650
Silicon photonic interconnects offer a promising solution to meeting the ever growing demand for more efficient I/O bandwidth density. We report an ultralow power 80 Gb/s arrayed silicon photonic transceiver for dense, large bandwidth inter/intrachip
Autor:
Herb Schwetman, Mehdi Asghari, Ron Ho, Dinesh Patil, Thierry Pinguet, Dazeng Feng, Jon Lexau, W. Y. Jan, Xuezhe Zheng, Frankie Liu, J. E. Cunningham, Ashok V. Krishnamoorthy, Keith W. Goossen, Guoliang Li, R.G. Rozier
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 17:357-376
Optical links have successfully displaced electrical links when their aggregated bandwidth-distance product exceeds ~100 Gb/s-m because their link energy per bit per unit distance is lower. Optical links will continue to be adopted at distances of 1
Autor:
Dinesh Patil, John E. Cunningham, Ivan Shubin, Ashok V. Krishnamoorthy, Xuezhe Zheng, Ron Ho, Herb Schwetman, Jon Lexau, Frankie Liu, Elad Alon, Guoliang Li
Publikováno v:
IEEE Design & Test of Computers. 27:10-19
Advances in silicon photonic technology have made possible the use of optical communication in large-scale chip arrays. This article shows how such a structure utilizes the high bandwidth of the optical links through optical proximity communication t
Autor:
Tarik Ono, Robert D. Hopkins, Ron Ho, Justin M. Schauer, Alex Chow, Frankie Liu, Robert J. Drost
Publikováno v:
IEEE Journal of Solid-State Circuits. 43:52-60
We present circuits for driving long on-chip wires through a series capacitor. The capacitor improves delay through signal pre-emphasis, offers a reduced voltage swing on the wire for low energy without a second power supply, and reduces the driven l
Autor:
Shiyun Lin, Jin Yao, Ron Ho, Kannan Raj, Namseok Park, Eric Chang, Ashok V. Krishnamoorthy, Ivan Shubin, Philip Amberg, Jon Lexau, Xuezhe Zheng, Frankie Liu, John E. Cunningham, Stevan S. Djordjevic, Hiren D. Thacker
Publikováno v:
Optics express. 23(10)
We report on a packaged prototype of a WDM photonic transceiver. It is an all-solid state hybrid assembly based on 130nm SOI photonic circuitry integrated with a 40nm CMOS VLSI driver. Our prototype supports eight tunable WDM channels operating at 10
Autor:
Ying Luo, Hiren D. Thacker, Xuezhe Zheng, P. Amberg, John E. Cunningham, Shiyun Lin, Kannan Raj, Frankie Liu, Roshanak Shafiiha, Arin Abed, Dazeng Feng, Ivan Shubin, Jin-Hyoung Lee, Ron Ho, Hong Liang, Eric Chang, Jin Yao, John Simons, Ashok V. Krishnamoorthy, Stevan S. Djordjevic, Jon Lexau, Mehdi Asghari
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
We present the packaging of a large multi-chip energyefficient WDM silicon photonic interconnect prototype enabled by hybrid integration, high-accuracy optical alignment and thermal-mechanical aware design and assembly.
Autor:
Jon Lexau, Guoliang Li, J. E. Cunningham, Jin Yao, Ashok V. Krishnamoorthy, Ronald Ho, Hiren D. Thacker, Ivan Shubin, Ying Luo, Xuezhe Zheng, Frankie Liu
Publikováno v:
IEEE Photonics Technology Letters. 24:1260-1262
We report on a 10-Gb/s digital-to-digital CMOS silicon photonic link with a 2.1-pJ/bit on-chip energy efficiency, using a photon energy of 1.4-pJ/bit and 680-fJ/bit transceivers that integrate 130-nm SOI CMOS photonic devices with 40-nm bulk CMOS cir