Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Frank Zachariasse"'
Publikováno v:
International Symposium for Testing and Failure Analysis.
High numerical aperture (NA) laser scanning for fault localization requires the use of special lenses aimed at creating a tightly focused laser spot within an integrated circuit. Typically, extrinsic solid immersion lenses are employed that optimize
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c3e53ec35809571d26b19ec504bd585d
https://doi.org/10.31399/asm.cp.istfa2019p0099
https://doi.org/10.31399/asm.cp.istfa2019p0099
Publikováno v:
EDFA Technical Articles. 17:14-20
During a silicon debug, it was found that the gain of a radio receiver circuit dropped dramatically at certain frequencies due to an imbalance in one of the signal paths. A metal fix was proposed, but consensus could not be reached on how to validate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a1ca19e1cc167e42d3af5d9f1014329
https://doi.org/10.31399/asm.edfa.2015-4.p014
https://doi.org/10.31399/asm.edfa.2015-4.p014
Publikováno v:
International Symposium for Testing and Failure Analysis.
We report on the use of Fresnel lenses in the failure analysis (FA) of actual failures. The design parameters affecting the performance of Fresnel lenses in terms of resolution, magnification, and field of view have been analyzed. It is demonstrated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3bf8ee1b676ad1d55618b2b70bb9dadd
https://doi.org/10.31399/asm.cp.istfa2016p0272
https://doi.org/10.31399/asm.cp.istfa2016p0272
Publikováno v:
Microelectronics Reliability. 50:1417-1421
Laser modulation mapping is a non-invasive technique to make visible those transistors inside an IC that carry a given signal. The ability to map out those locations where a signal is present, and those where it is absent (for example, because of a d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::37e377da78bd73808e9d04af1c1d874f
https://doi.org/10.1016/j.microrel.2010.07.054
https://doi.org/10.1016/j.microrel.2010.07.054
Autor:
Frank Zachariasse, Jan van Hassel
Publikováno v:
Microelectronics Reliability. 48:1289-1294
Intermittently failing IC’s are difficult to debug with techniques such as time resolved photoemission (TRE), that measure internal signals, because the measurements will contain a mixture of passing and failing behaviour. In this paper, we show th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac0d27dc4dba50c287c1c46da118d2f5
https://doi.org/10.1016/j.microrel.2008.06.034
https://doi.org/10.1016/j.microrel.2008.06.034
Publikováno v:
Microelectronic Engineering. 35:63-66
When titanium metal is implanted with 30 kV gallium ions and subsequently etched by SF6 plasma in a clean ECR etcher, an etch stop effect is found where the local implantation dose exceeds 5×1015 gallium ions cm−2. Implanted titanium regions remai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d5f7d43836332602e550940964a75fde
https://doi.org/10.1016/s0167-9317(96)00148-7
https://doi.org/10.1016/s0167-9317(96)00148-7
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper presents a quick, reliable, and fully quantitative method of measuring the intermetallic coverage of copper to aluminium bonding at time zero and post reliability stressing. This method is currently used in select manufacturing quality con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::777b865a764d62ad2dc9d5e9cbcfe944
https://doi.org/10.31399/asm.cp.istfa2013p0297
https://doi.org/10.31399/asm.cp.istfa2013p0297
Autor:
Arjan Mels, Frank Zachariasse
Publikováno v:
International Symposium for Testing and Failure Analysis.
Although RIL, SDL and LADA are slightly different, the main operating principle is the same and the theory for defect localization presented in this paper is applicable to all three methods. Throughout this paper the authors refer to LADA, as all exp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d26c0d8fee2962ad74763e1633a9e63e
https://doi.org/10.31399/asm.cp.istfa2007p0006
https://doi.org/10.31399/asm.cp.istfa2007p0006
Autor:
Frank Zachariasse, Martijn Goossens
Publikováno v:
International Symposium for Testing and Failure Analysis.
In this paper, we demonstrate a practical alternative to the conventional SIL, which overcomes the above limitations. We show that it is possible to fabricate a lens directly on the back side of the silicon of the device under test. This lens works o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::533645a824748dbb06a742a3f13de579
https://doi.org/10.31399/asm.cp.istfa2005p0001
https://doi.org/10.31399/asm.cp.istfa2005p0001
Autor:
Frank Zachariasse, Edward John Coyne
Publikováno v:
Journal of Micromechanics and Microengineering. 18:045016
This paper reports on the design, fabrication and evaluation of solid immersion blazed-phase diffractive optics for near-infrared radiation of wavelength 1064 nm. The practical application of enhancing the analysis of integrated circuits using scanni
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d396d417be279f67b07c1e2fed7bbc5c
https://doi.org/10.1088/0960-1317/18/4/045016
https://doi.org/10.1088/0960-1317/18/4/045016