Zobrazeno 1 - 10
of 13
pro vyhledávání: '"Frank Windrich"'
Publikováno v:
IMAPSource Proceedings. 2022
This publication presents lithography results for 3D wafer-level system integration applications using a reticle free maskless lithography system VPG+ 400 from Heidelberg Instruments. The focus is on high density Cu redistribution layer (RDL) formati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c11104539ce7efcf77af480c3d72f757
https://doi.org/10.4071/001c.74634
https://doi.org/10.4071/001c.74634
Autor:
Eva Bittrich, Dominik Martens, Lars Bittrich, Klaus-Jochen Eichhorn, Liane Häussler, Frank Windrich
Publikováno v:
Polymer Testing. 64:48-54
We characterized the glass transition temperature Tg of thin polyimide films by temperature-dependent spectroscopic ellipsometry and compared the results to DSC measurements of the bulk polymer. The effect of the curing temperature on Tg and the ther
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f0d57cdd7d691a4db05a31ce2e4d4317
https://doi.org/10.1016/j.polymertesting.2017.09.030
https://doi.org/10.1016/j.polymertesting.2017.09.030
Autor:
Klaus-Dieter Lang, Gerd Schlottig, M. Jurgen Wolf, Wolfram Steller, Frank Windrich, Stephen Robertson, Thomas Brunschwiler, J. Keller, Raul Mrosko, Hermann Oppermann, Douglas Bremner
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
High operation temperatures are a main impact factor for long-term reliability. An efficient cooling approach is crucial especially for high performance computing processors (HPC). As reference, the “International Technology Roadmap for Semiconduct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dde94ce59c819c7e6886aa4e603e3370
https://doi.org/10.1109/estc.2018.8546344
https://doi.org/10.1109/estc.2018.8546344
Autor:
Brigitte Voit, Eva Bittrich, Frank Windrich, Klaus-Jochen Eichhorn, Alexander Schwarz, Mikhail Malanin
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Different in-situ methods were utilized to study thin film polyimide layers in the context of low-temperature cure processes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6eceb8e467d33900a93eeeb85447e26
https://doi.org/10.1109/estc.2018.8546416
https://doi.org/10.1109/estc.2018.8546416
Publikováno v:
International Symposium on Microelectronics. 2015:000046-000049
Within “More than Moore” concepts interposer based packaging technologies, known as 2.5D/3D wafer level system integration, open up a wide range of miniaturized multi-functional system solutions. Pending of the final application dedicated interpo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::af2e40dfc073fd3a65cbcc09f5bd58ee
https://doi.org/10.4071/isom-2015-tp23
https://doi.org/10.4071/isom-2015-tp23
Autor:
Brigitte Voit, Dieter Fischer, Martin G. J. Löder, Frank Windrich, Matthias Labrenz, Klaus-Jochen Eichhorn, Mikhail Malanin, Andrea Käppler
Publikováno v:
Analytical and Bioanalytical Chemistry. 407:6791-6801
The presence of microplastics in aquatic ecosystems is a topical problem and leads to the need of appropriate and reliable analytical methods to distinctly identify and to quantify these particles in environmental samples. As an example transmission,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3b1f2fa6f61e6df964c902cf5e192c6c
https://doi.org/10.1007/s00216-015-8850-8
https://doi.org/10.1007/s00216-015-8850-8
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
Rapid scan in-situ Fourier Transform InfraredSpectroscopy (FT-IR) was used to characterize the cureprocess of two common low-temperature cure thin filmpolymer materials for wafer-level packaging applications. Beside a discussion of the spectral chang
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b048f9325e7203d180647d92532c6678
https://doi.org/10.1109/ectc.2016.9
https://doi.org/10.1109/ectc.2016.9
Autor:
Emiel J. Kappert, Nieck E. Benes, Brigitte Voit, Mikhail Malanin, Frank Windrich, Klaus-Jochen Eichhorn, Liane Häussler
Publikováno v:
European polymer journal, 84, 279-291. Elsevier
The imidization reaction in thin films of an ester-type photosensitive polyimide is investigated in the temperature range of 50–450 °C by temperature dependent rapid-scan in-situ FT-IR spectroscopy, thermo-ellipsometric analysis and thermogravimet
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::91896ba31ab14e4f46b3201426a514ae
https://research.utwente.nl/en/publications/b0304c08-457b-4e35-8ffc-4072c6182ef5
https://research.utwente.nl/en/publications/b0304c08-457b-4e35-8ffc-4072c6182ef5
3D Integration technologies have to deal with a complex combination of materials and substrates. Downstream processing in this technology field is limited to a temperature range of 99% degree of imidization can be achieved with a curing process of 3h
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::09a01e401800707185dd2385c3f12601
https://publica.fraunhofer.de/handle/publica/236652
https://publica.fraunhofer.de/handle/publica/236652
Autor:
Frank Windrich, Andreas Schenke
Publikováno v:
3DIC
The demand of smaller form factors, multifunctional microelectronics and thereby the need for improved electrical performance and reliability is the key driver for the development of 3D technologies with through silicon vias (TSV). Different through
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e689addd68bd4a1a89e5e83199909e9
https://doi.org/10.1109/3dic.2013.6702371
https://doi.org/10.1109/3dic.2013.6702371