Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Frank Stepniak"'
Autor:
Rao Tummala, Naomi Lollis, Christoph Schnitter, Nathan Neuhart, Himani Sharma, P. M. Raj, Kamil-Paul Rataj, Saumya Gandhi, Frank Stepniak, Matthew D. Romig, Parthasarathi Chakraborti
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
This paper demonstrates silicon-integrated, thinfilm, high-density tantalum capacitors for integrated power modules. The capacitors in form-factors of less than 75µm showed stable capacitance densities of more than 0.3 µF/mm2 with leakage of less t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::100fa4c6fb222f3c0c793fdcac2d40d8
https://doi.org/10.1109/ectc.2016.270
https://doi.org/10.1109/ectc.2016.270
Autor:
Frank Stepniak
Publikováno v:
Microelectronics Reliability. 44:805-814
The underfill-facilitated migration from ceramic to lower cost laminate substrates has become a powerful enabler of direct chip attach by offering lower cost, greater electrical functionality, and a smaller system footprint over comparable packaging
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54762d7a4443fea5f76fa652f260405d
https://doi.org/10.1016/j.microrel.2003.08.006
https://doi.org/10.1016/j.microrel.2003.08.006
Autor:
Frank Stepniak
Publikováno v:
Microelectronics Reliability. 42:1921-1930
The criteria used to determine electrical failure was explored during accelerated testing of underfilled flip chip joints as a function of both different thermal cycling conditions and different sampling methods. The criteria was based on resistance
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08202c8368f0b149a2c95494fd021a7d
https://doi.org/10.1016/s0026-2714(02)00121-x
https://doi.org/10.1016/s0026-2714(02)00121-x
Publikováno v:
Journal of the American Chemical Society. 114:10492-10497
Variable-energy photoelectron spectroscopy of thin film Mo[sub 2](O[sub 2]CCH[sub 3])[sub 4] on a GaAs substrate in ultrahigh vacuum is used to examine the valence ionizations of the quadruple metal-metal bond. The changes in photoionization cross se
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db3e71b1b5e4ffee2a3032ca54a94b7f
https://doi.org/10.1021/ja00052a053
https://doi.org/10.1021/ja00052a053
Autor:
Robert L. D. Zenner, Scott B. Charles, Matthew R. Walsh, Arun K. Chaudhuri, F. Bruce Li, Robert B. Kinney, Frank Stepniak, Scott Post, Michael A. Kropp
Publikováno v:
SAE Technical Paper Series.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::76b0a785ce62ca3ca2346eb3ee9b1131
https://doi.org/10.4271/2002-01-1050
https://doi.org/10.4271/2002-01-1050
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