Výsledky vyhledávání - "Frank Seigneur"

Autor: Yannick Fournier, Peter Ryser, Jacques Jacot, Frank Seigneur, Thomas Maeder

Publikováno v: Scopus-Elsevier

This article describes the design and fabrication of a hermetic LTCC package for an optical MEMS chip designed for space applications. The package must ensure electrical and optical connections, mechanical positioning, atmosphere control, and finally

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1e9f1cf496692339f87e8e4ca200380d
https://doi.org/10.4071/1551-4897-6.1.32

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A case study of surface tension gripping: the watch bearing

Autor: Sandra Koelemeijer, Jacques Jacot, Pierre Lambert, Frank Seigneur

Publikováno v: Journal of Micromechanics and Microengineering. 16:1267-1276

This paper reports the modeling and experimental work done for the design of a microgripper using surface tension forces for the handling of submillimetric balls of a watch bearing. Its originality lies in the adaptation of existing capillary forces

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::fe254799c172560a203a00f2df54bde9
https://doi.org/10.1088/0960-1317/16/7/021

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Design of a Capillary Gripper for a Submillimetric Application

Autor: Pierre Lambert, Jacques Jacot, Sandra Koelemeijer, Frank Seigneur

Publikováno v: IFIP International Federation for Information Processing ISBN: 0387312765
IPAS

This paper describes the study of a gripper using the surface tension effects to pick and place the 0.5mm or 0.3mm diameter balls of a millimetric watch bearing. Two liquid supply strategies have been tested (pressure drive and tip dip). The effects

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::387207d8d7b6034a4a0f6b16df439e9b
https://doi.org/10.1007/0-387-31277-3_1

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Laser Sealed Packaging for Microsystems

Autor: Jacques Jacot, Frank Seigneur

Publikováno v: IFIP International Federation for Information Processing ISBN: 0387312765
IPAS

Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advanta

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::93fbd0f46528dda843829e1888a1fe47
https://doi.org/10.1007/0-387-31277-3_29

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