Zobrazeno 1 - 10
of 57
pro vyhledávání: '"Frank R. Libsch"'
Publikováno v:
International Symposium on Microelectronics. 2020:000181-000184
This paper discusses some design and implementation issues related to GaN micro-LED (μLED) incorporated into the heterogeneous packaging of IBM’s smart and secure sensor platform. For cost effective μLEDs, the sapphire substrate needs to be singu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::468519e31cd83ae47312337ad363d006
https://doi.org/10.4071/2380-4505-2020.1.000181
https://doi.org/10.4071/2380-4505-2020.1.000181
Autor:
John A. Ott, Stephen W. Bedell, Ning Li, Kevin Han, Marinus Hopstaken, William T. Spratt, Frank R. Libsch, Qinglong Li, Devendra K. Sadana
Publikováno v:
Nature Photonics. 13:588-592
Conventional light-emitting diodes (LEDs) face an efficiency droop at low current due to non-radiative recombination overtaking radiative recombination at low carrier density. To overcome this universal problem, we develop LEDs with high efficiency a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91f2929fb0c6bbe1a6c6b15c1f640a6d
https://doi.org/10.1038/s41566-019-0463-x
https://doi.org/10.1038/s41566-019-0463-x
Autor:
Devendra K. Sadana, Marinus Hopstaken, Oki Gunawan, Stephen W. Bedell, Kevin Han, Jinhan Ren, Chitra Subramanian, Frank R. Libsch, John A. Ott, Ning Li, Cyril Cabral, Ghavam G. Shahidi, William T. Spratt
Publikováno v:
Advanced materials (Deerfield Beach, Fla.). 32(49)
Advancement in microelectronics technology enables autonomous edge computing platforms in the size of a dust mote (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::609bbba47e527f62983a358a95c01b95
https://pubmed.ncbi.nlm.nih.gov/33095497
https://pubmed.ncbi.nlm.nih.gov/33095497
Autor:
Kevin Han, John A. Ott, Chitra Subramanian, Frank R. Libsch, Cyril Cabral, William T. Spratt, Oki Gunawan, Stephen W. Bedell, Marinus Hopstaken, Ghavam G. Shahidi, Ning Li, Jinhan Ren, Devendra K. Sadana
Publikováno v:
Advanced Materials. 32:2070369
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d335e62e309e66094d86007f07c60a76
https://doi.org/10.1002/adma.202070369
https://doi.org/10.1002/adma.202070369
Publikováno v:
IEEE Photonics Technology Letters. 26:825-828
The design and demonstration of photonic grating couplers with improved efficiencies monolithically integrated in IBM's 7RF silicon-on-insulator (SoI) complementary metal–oxide–semiconductor (CMOS) technology offering are reported. The grating co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3b9d971c195f01d67c297ccc481981d0
https://doi.org/10.1109/lpt.2014.2306999
https://doi.org/10.1109/lpt.2014.2306999
Autor:
Frank R. Libsch, Alexander V. Rylyakov, Clint L. Schow, Christian W. Baks, Fuad E. Doany, Christopher V. Jahnes, Benjamin G. Lee, D.M. Kuchta
Publikováno v:
Journal of Lightwave Technology. 31:672-680
We report here on the design, fabrication and characterization of 48-channel parallel optical transceivers demonstrating terabit/sec data transfer rate. The 0.48 Tb/s transmit plus 0.48 Tb/s receive throughput was achieved using a second-generation s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::348e84c76c5e37c32b36e024895e4067
https://doi.org/10.1109/jlt.2012.2217938
https://doi.org/10.1109/jlt.2012.2217938
Autor:
Mounir Meghelli, Marwan H. Khater, Edward W. Kiewra, F. Horst, W. M. J. Green, Jessie Rosenberg, D. M. Gill, N. B. Feilchenfeld, Christian W. Baks, F. G. Anderson, Yves Martin, B.J. Offrein, Jonathan E. Proesel, Frank R. Libsch, Chi Xiong, Wilfried Haensch, Wesley D. Sacher, John J. Ellis-Monaghan, Jens Hofrichter, Andreas D. Stricker, Jason S. Orcutt, Tymon Barwicz, Ankur Agrawal
Publikováno v:
OFC
Monolithic CMOS photonics seeks to minimize total transceiver cost by simplifying packaging, design and test. Here we examine 25 Gb/s applications in the context of integrated transistor performance and demonstrate a 4λ×25 Gb/s reference design.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8745224ca433ca21b29fc95c2ef7e995
https://doi.org/10.1364/ofc.2016.th4h.1
https://doi.org/10.1364/ofc.2016.th4h.1
Autor:
Russell A. Budd, D. Bajkowski, Cornelia K. Tsang, Fuad E. Doany, Benjamin G. Lee, Roger Dangel, Chase Carver, Jessie Berry, Christian W. Baks, Frank R. Libsch, Jianzhuang Huang, How Lin, Clint L. Schow, Jeffrey A. Kash, B. Chan, John U. Knickerbocker
Publikováno v:
Journal of Lightwave Technology. 30:560-571
We report here on the design, fabrication, and characterization of highly integrated parallel optical transceivers designed for Tb/s-class module-to-module data transfer through polymer waveguides integrated into optical printed circuit boards (o-PCB
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb81d763a8b0c0a28fc843accc6290e9
https://doi.org/10.1109/jlt.2011.2177244
https://doi.org/10.1109/jlt.2011.2177244
Autor:
Charles A. Whiting, Thai Doan, Jessie Rosenberg, Yves Martin, Natalie B. Feilchenfeld, Robert K. Leidy, Carol Reinholm, John J. Ellis-Monaghan, Fuad E. Doany, Tymon Barwicz, D. M. Gill, Wilfried Haensch, Sebastian Engelmann, Marwan H. Khater, Steven M. Shank, Ankur Agrawal, Mounir Meghelli, J. Ferrario, B.J. Offrein, Christian W. Baks, B. Cucci, Jeffrey C. Maling, Eric A. Joseph, Christa R. Willets, Jason S. Orcutt, S. Chilstedt, Edward W. Kiewra, Chi Xiong, Y. Ding, F. Baker, Jens Hofrichter, Frederick G. Anderson, Dinh Dang, Jonathan E. Proesel, Crystal M. Hedges, Frank R. Libsch, M. Nicewicz, Michael S. Gordon, Xiaowei Tian, Bruce W. Porth, K. McLean, W. M. J. Green, Wesley D. Sacher, Andreas D. Stricker, Folkert Horst
Publikováno v:
2015 IEEE International Electron Devices Meeting (IEDM).
A manufacturable platform of CMOS, RF and opto-electronic devices fully PDK enabled to demonstrate a 4×25 Gb/s reference design is presented. With self-aligned fiber attach, this technology enables low-cost O-band data-com transceivers. In addition,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c4752de579ffe16728698630b20782bd
https://doi.org/10.1109/iedm.2015.7409768
https://doi.org/10.1109/iedm.2015.7409768
Autor:
Laurent Schares, Petar Pepeljugoski, Christian W. Baks, Bert Jan Offrein, Roger Dangel, Frank R. Libsch, Russell A. Budd, Fuad E. Doany, D.M. Kuchta, Folkert Horst, Jeffrey A. Kash, Clint L. Schow
Publikováno v:
IEEE Transactions on Advanced Packaging. 32:345-359
We have developed parallel optical interconnect technologies designed to support terabit/s-class chip-to-chip data transfer through polymer waveguides integrated in printed circuit boards (PCBs). The board-level links represent a highly integrated pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::761e6dfde4c7155427636f03809d8e33
https://doi.org/10.1109/tadvp.2009.2014877
https://doi.org/10.1109/tadvp.2009.2014877