Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Frank L. Pompeo"'
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
Defect isolation and failure analysis is a key factor that drive development and manufacturing yield improvements in semiconductor packaging industry. From a manufacturing point of view, ensuring adequate package reliability is becoming more challeng
Publikováno v:
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
In this paper, we discuss the design of a four (4) chip Multi Component Carrier (MCC) package and feasibility for use in high-end server/mainframe applications. A new class of organic, Chip Scale Package (CSP) and associated design ground rules were
Publikováno v:
2015 IEEE 65th Electronic Components and Technology Conference (ECTC).
Kirkendall voids are defects that significantly reduce the mechanical properties as well as the electromigration (EM) resistance of Sn base solder joints. In this paper, an effective method was utilized in the micro-joints to fully convert Sn-Ag sold
Autor:
Chenzhou Lian, Frank L. Pompeo, Hsichang Liu, J. Bunt, H. Longworth, Kathryn C. Rivera, Shidong Li, Kamal K. Sikka, Hongqing Zhang
Publikováno v:
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
This paper discusses a thermal reliability testing experiment and failure analysis (FA) in 32nm SOI Si technology chip packages. Thermal performance of the TIM materials is monitored and physical failure analysis is performed on test vehicle packages
Autor:
Kurt A. Smith, Thomas A. Wassick, Katsuyuki Sakuma, Jae-Woong Nah, Tunga Krishna R, Frank L. Pompeo, Eric D. Perfecto
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
A differential heating/cooling chip join method was developed for Pb-free flip chip packaging of ultra low-k (ULK) technology Si chips on organic substrates to prevent Chip-Package Interaction (CPI) — related damage upon chip joining. A chip was mo
Autor:
Frank L. Pompeo, Thomas E. Lombardi, Edmund Blackshear, JoonYeob Lee, Joonyoung Choi, KyungMooon Kim, Jean Audet, Kyoji Kondo, ChangWoo Park, Yoichi Miyazawa, Shunichiro Matsumoto, YoungHyuk Jeong
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
The trend in large body, high performance integrated circuit packaging for the 32 nm semiconductor node and beyond is towards low dielectric loss to enable high bandwidth / low loss channels, and low thermal expansion to protect fragile, ultra-low di
Phase change materials as a viable thermal interface material for high-power electronic applications
Publikováno v:
Scopus-Elsevier
Phase change materials (PCMs) are an attractive alternative to thermal greases/pads. While their thermal conductivity is not as good as greases, they are more manufacturable. This paper reports on evaluation of PCMs for high power electronic applicat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7cfbf61231b4193fc419dd8fd1a8810a
http://www.scopus.com/inward/record.url?eid=2-s2.0-4444358836&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-4444358836&partnerID=MN8TOARS
Autor:
John U. Knickerbocker, Jeffrey A. Zitz, Sudipta K. Ray, Lewis S. Goldmann, Sushumna Iruvanti, Srinivasa S. N. Reddy, D. L. Thomas, Kevin M. Prettyman, Frank L. Pompeo, Hai P. Longworth, Roger D. Weekly, Patrick A. Coico, Benjamin V. Fasano, M. G. Nealon, D. L. Edwards, Richard A. Shelleman, Subhash L. Shinde, Peter J. Brofman, Thomas E. Lombardi, Anand Haridass, Kenneth C. Marston, A. F. Tai, Harvey C. Hamel, James N. Humenik
Publikováno v:
Scopus-Elsevier
In 2001, IBM delivered to the marketplace a high-performance UNIX?®-class eServer based on a four-chip multichip module (MCM) code named Regatta. This MCM supports four POWER4 chips, each with 170 million transistors, which utilize the IBM advanced
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::38304b1c0df3ba4baf72d3567ea03c5f
http://www.scopus.com/inward/record.url?eid=2-s2.0-0037481243&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-0037481243&partnerID=MN8TOARS
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