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pro vyhledávání: '"Frank J.C. Lee"'
Autor:
Frank J.C. Lee
Publikováno v:
ISPD
Heterogeneous three-dimensional (3-D) package-level integration plays an increasingly important role in the design of higher functional density and lower power processors for general computing, machine learning and mobile applications. In TSMC's 3DFa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf25138ac034e9ba58338ed1bc86c780
https://doi.org/10.1145/3439706.3446881
https://doi.org/10.1145/3439706.3446881
Publikováno v:
2020 IEEE Symposium on VLSI Technology.
Heterogeneous package-level integration plays an increasing role in higher functional density and lower power processors for general computing, machine learning and mobile applications. This paper will review technology trends and challenges for 2.5D
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9b9e540732907e9ba5c6498125a53c57
https://doi.org/10.1109/vlsitechnology18217.2020.9265085
https://doi.org/10.1109/vlsitechnology18217.2020.9265085