Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Frank Engel Rasmussen"'
Autor:
Søren Jacobsen, Søren Rosendal Jensen, Arda D. Yalcinkaya, Ole Hansen, Torben Rasmussen, Frank Engel Rasmussen
Publikováno v:
ResearcherID
A deep reactive ion etch (DRIE) process for fabrication of high aspect ratio trenches has been developed. Trenches with aspect ratios exceeding 20 and vertical sidewalls with low roughness have been demonstrated. The process has successfully been use
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::785f7f2c82e3aebe5dce767c24f53288
https://doi.org/10.1088/0031-8949/2004/t114/047
https://doi.org/10.1088/0031-8949/2004/t114/047
Publikováno v:
Sensors and Actuators A: Physical. 92:242-248
The magnetic properties of pulse reverse (PR) electroplated CoNiFe and DC electroplated NiFe are presented. CoNiFe is a very promising material for magnetic microsystems due to the possibility of achieving a high saturation flux density (Bs) and a lo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a21d8d94ddabc8dd9bfaa1fc8263114a
https://doi.org/10.1016/s0924-4247(01)00556-8
https://doi.org/10.1016/s0924-4247(01)00556-8
Publikováno v:
ResearcherID
Scopus-Elsevier
Rasmussen, F E, Heschel, M & Hansen, O 2003, Batch Fabrication of Through-Wafer Vias In CMOS Wafers for 3-D Packaging Applications . in Proceedings of the 53rd Electronic Components and Technology Conference (ECTC) . pp. 634-639, 53rd Electronic Components and Technology Conference, New Orleans, Louisiana, United States, 27/05/2003 .
Scopus-Elsevier
Rasmussen, F E, Heschel, M & Hansen, O 2003, Batch Fabrication of Through-Wafer Vias In CMOS Wafers for 3-D Packaging Applications . in Proceedings of the 53rd Electronic Components and Technology Conference (ECTC) . pp. 634-639, 53rd Electronic Components and Technology Conference, New Orleans, Louisiana, United States, 27/05/2003 .
A technique for fabrication of through-wafer vias in silicon wafers containing complementq metal-oxide- semiconductor (CMOS) circuitry is presented. The application of the presented through-wafer vias with existing wafer level chip size packaging (WL
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9da1bb340f4895baf561a3c734aa277f
https://doi.org/10.1109/ectc.2003.1216348
https://doi.org/10.1109/ectc.2003.1216348
Publikováno v:
Rasmussen, F E, Frech, J, Heschel, M & Hansen, O 2003, Fabrication of High Aspect Ratio Through-Wafer Vias in CMOS Wafers for 3-D Packaging Applications . in Proceedings of the 12th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) . vol. 2, IEEE, pp. 1659-1662, 12th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), Boston, United States, 09/06/2003 .
ResearcherID
ResearcherID
A process for fabrication of through-wafer vias in CMOS wafers is presented. The process presented offers simple and well controlled fabrication of through-wafer vias using DRIE formation of wafer through-holes, low temperature deposition of through-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b749a1a246c76a0ddbd6da0cd12e82b6
https://doi.org/10.1109/sensor.2003.1217101
https://doi.org/10.1109/sensor.2003.1217101
Publikováno v:
The Journal of the Acoustical Society of America. 133:1854
The present invention relates to a listening system, e.g. a hearing aid system, comprising a charging station and one or more listening devices, e.g. hearing instruments. It further relates to a method of operating a listening device. An object of th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::be3681842fc10dc9ea18960f42b95c51
https://doi.org/10.1121/1.4795086
https://doi.org/10.1121/1.4795086
Publikováno v:
The Journal of the Acoustical Society of America. 133:611
A rechargeable battery is provided comprising a flexible elongate electron conductive core (1) surrounded by a first electrochemically active layer (2), and a second electrochemically active layer (4), separated by a separation layer (3) and where an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d2e2b289a7b42b897098e2345b4ff15
https://doi.org/10.1121/1.4774183
https://doi.org/10.1121/1.4774183
Publikováno v:
The Journal of the Acoustical Society of America. 122:704
The invention concerns a hearing aid with at least one primary sound to electric converting transducer converting sounds in the environment into electrical signals and a signal processing unit for amplifying the electrical signal according to the nee
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3369e15211acbbe6112de73d2684763e
https://doi.org/10.1121/1.2771340
https://doi.org/10.1121/1.2771340