Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Frank Bruening"'
Autor:
Lutz Brandt, Tobias Bernhard, Simon Bamberg, Michael Merschy, Hailuo Fu, Frank Bruening, Zhiming Liu, Sara Hunegnaw, Robin Taylor
Publikováno v:
International Symposium on Microelectronics. 2013:000635-000640
Ultra-miniaturization and 3D integration of electronic systems require interposers with a very high density of off-chip interconnections. Silicon and glass interposers are being developed widely to meet these needs. Through hole via formation or Thro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a58332da0d618879c319854e8734203
https://doi.org/10.4071/isom-2013-wp15
https://doi.org/10.4071/isom-2013-wp15
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:001535-001554
The focus of the chip and IC substrate manufacturing industry for interposers is currently shifting from organic substrates to inorganic materials. Interposers overcome the dimensional mismatch between a die and an organic PWB substrate and need to b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f065137cac38a6a07230e6744449f908
https://doi.org/10.4071/2011dpc-wp12
https://doi.org/10.4071/2011dpc-wp12