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pro vyhledávání: '"Francois Pasqualini"'
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 33:86-95
For reasons of productivity and throughput maximization, semiconductor equipment suppliers provide multiple-chamber machines to allow the split of production runs over parallel chambers. These latter are expected to perform identically and fabricate
Publikováno v:
CASE
Semiconductor manufacturing is a continuously challenging and competitive industry. It is important to detect any anomalies in the production facilities, or fabs, as they occur to avoid defect accumulations and loss of performance. In this paper we p
Publikováno v:
2019 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE).
Achieving the delivery requirements with respect to the volumes and quality at the same time in semiconductor fabrication requires critically controlling the process variability. One obvious issue resulted from the process variability is the machine/
Publikováno v:
29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), Apr 2018, Saratog, New York, United States
29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), Apr 2018, Saratog, New York, United States
In all manufacturing industries, parallel machines/chambers at a single production area are expected to perform identically and, most importantly, to yield similar product quality. However, this is usually not the case in real practice, especially wh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::21d6976ca288c662744f583ba25ec7e7
https://hal.archives-ouvertes.fr/hal-02067516
https://hal.archives-ouvertes.fr/hal-02067516
Publikováno v:
International Journal of Computer Theory and Engineering. 7:191-196
Autor:
Frank Staals, P. Gilgenkrantz, J.-G. Simiz, A. Tishchenko, Wim Tjibbo Tel, Alexandre Villaret, T. Hasan, Francois Pasqualini, B. Le-Gratiet, C. Prentice
Publikováno v:
SPIE Proceedings.
With continuing dimension shrinkage using the TWINSCAN NXT:1950i scanner on the 28nm node and beyond, the imaging depth of focus (DOF) becomes more critical. Focus budget breakdown studies [Ref 1, 5] show that even though the intrafield component sta
Publikováno v:
SPIE Proceedings.
In the last years a flourishing number of techniques such as High Order Control or mappers have been proposed to improve overlay control. However a sustainable improvement requires sometimes understanding the underlying causes of the overlay limiting
Publikováno v:
Microelectronic Engineering. 6:69-75
Autor:
Walter Mamie, Harvey Agnew, George C. Reader, Max Esser, Francois Pasqualini, Edward R. Pinckney, Don H. Scott, Margaret Olencki
Publikováno v:
Hospital Topics. 39:19-26
Akademický článek
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