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pro vyhledávání: '"Francois J. Henley"'
Autor:
Francois J. Henley
Publikováno v:
SID Symposium Digest of Technical Papers. 50:232-235
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba7e1156a1d0eaa32c208bc9d267a66d
https://doi.org/10.1002/sdtp.12898
https://doi.org/10.1002/sdtp.12898
Autor:
Francois J. Henley
Publikováno v:
SID Symposium Digest of Technical Papers. 49:688-691
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ebe810e16db5781304f2469810873020
https://doi.org/10.1002/sdtp.12351
https://doi.org/10.1002/sdtp.12351
Autor:
Francois J. Henley
Publikováno v:
SID Symposium Digest of Technical Papers. 49:86-89
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fab072c3bc295fb3bf485f843b03136
https://doi.org/10.1002/sdtp.12647
https://doi.org/10.1002/sdtp.12647
Autor:
Nathan W. Cheung, Lucia Feng, William G. En, Michael A. Bryan, Wei Liu, Shu Qin, Michael I Current, Chung Chan, Ian S. Roth, Francois J. Henley, Albert Lamm, Igor J. Malik
Publikováno v:
Surface and Coatings Technology. 136:138-141
A plasma immersion ion implantation (PIII) system is described which provides the capability to bridge the range between research exploration and commercial applications for materials modification of electronic materials, with a particular focus on l
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f75d6e21b672b8e37032933a035271f0
https://doi.org/10.1016/s0257-8972(00)01043-4
https://doi.org/10.1016/s0257-8972(00)01043-4
Autor:
Francois J. Henley
Publikováno v:
2010 35th IEEE Photovoltaic Specialists Conference.
Eliminating high absorber material loss while allowing thin and ultra-thin crystalline silicon PV has been a “Holy Grail” of the crystalline silicon PV industry for decades. Generally called “kerf-free wafering”, the fundamental approach is t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0f2914a84f54219b1116446853f1dc5
https://doi.org/10.1109/pvsc.2010.5614096
https://doi.org/10.1109/pvsc.2010.5614096
Publikováno v:
2009 34th IEEE Photovoltaic Specialists Conference (PVSC).
A novel ion beam-induced cleaving process for slicing c-Si wafers ranging in thickness from 20µm to 150µm with near zero kerf-loss and markedly low overall cost has been developed and demonstrated to be capable of large-area thin PV substrate manuf
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a7de1d58e3f627ddda8096fe024e0be6
https://doi.org/10.1109/pvsc.2009.5411435
https://doi.org/10.1109/pvsc.2009.5411435
Autor:
Sien Kang, Francois J. Henley, Harry R. Kirk, Martin Fuerfanger, Lucia Feng, Michael I. Current, Igor J. Malik, Shari Farrens
Publikováno v:
MRS Proceedings. 681
An innovative suite of layer transfer technologies, collectively called the NanoCleaveTM Process, includes a non-porous cleave plane utilizing a compressive strain layer, growth of a high purity, crystalline device layer, plasma activation coupled wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2b0fb52012144f672dc4faa6e0e3b71
https://doi.org/10.1557/proc-681-i8.3
https://doi.org/10.1557/proc-681-i8.3
Publikováno v:
SPIE Proceedings.
Applications of the Voltage ImagingTM technique in testing active arrays used in AMLCDs have been widely discussed. Voltage ImagingTM is well known for its simplicity in interfacing with active array panels, and its superior voltage measurement accur
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::229ffe7a71f333b5660a9ce931f310e1
https://doi.org/10.1117/12.235345
https://doi.org/10.1117/12.235345
Autor:
James Andrew Sullivan, Francois J. Henley, Harry R. Kirk, Sien Kang, Albert Lamm, Philip James Ong
Publikováno v:
SID Symposium Digest of Technical Papers. 37:280
The fabrication of multilayer single-crystal on large-area FPD glass was demonstrated for the first time using a film layer-transfer method. Multiple substrate transfers were successfully made on FPD glass to release a 1000–4000 Angstrom film of si
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c35ff548893ed9914c77b0060835e8f1
https://doi.org/10.1889/1.2433478
https://doi.org/10.1889/1.2433478
Autor:
Francois J. Henley
Publikováno v:
SPIE Proceedings.
All current commercial test systems are limited to data and clock rates of less than 200 MHz. However, many devices being built today operate at data rates greater than 1 GHz (1000 MHz). The inability to make high-speed tests stems from the many prob
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ae2ccab8044c91c9a39ccff53a0f6f73
https://doi.org/10.1117/12.940387
https://doi.org/10.1117/12.940387