Zobrazeno 1 - 10
of 74
pro vyhledávání: '"Franco Zanon"'
Autor:
Isabela Galarda Varassin, Brunna Maria Setti Ximenes, Priscila Ambrósio Moreira, Mireille Maria Franco Zanon, Paula Elbl, Peter Löwenberg-Neto, Gabriel Augusto Rodrigues Melo
Publikováno v:
Acta Botânica Brasílica, Vol 26, Iss 1, Pp 251-255 (2012)
A atividade dos polinizadores é afetada pela disponibilidade de recursos. Flores que produzem mais néctar podem ser mais visitadas e assim apresentar maior produção de frutos. O efeito da produção de néctar na atividade dos polinizadores foi t
Externí odkaz:
https://doaj.org/article/896e1b26654f49b0aa40edf25f59db3a
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 18:377-382
A solder-joint crack due to thermal fatigue affects the reliability of light emitting diode assemblies. A new methodology is presented for the solder-joint lifetime estimation under a wide range of working conditions. The proposed method is based on
Autor:
De Coppi, Paolo †, Pozzobon, Michela, Piccoli, Martina, Vittoria Gazzola, Maria, Boldrin, Luisa, Slanzi, Elisa, Destro, Roberta, Zanesco, Luigi, Franco Zanon, Giovanni †, Gamba, Piergiorgio †
Publikováno v:
In Journal of Surgical Research 2006 135(1):85-91
Publikováno v:
Microelectronics Reliability. :42-46
Assessing electronic systems' reliability using prediction handbooks (e.g. MIL-HDBK-217) can lead to wrong reliability predictions due to the assumption of a constant failure rate and the inaccuracy of the proposed semi-empirical models. Despite diff
Autor:
Bart Allaert, Riet Labie, Johan De Baets, Lieven Degrendele, Filip Vanhee, Franco Zanon, Bart Vandevelde, Ralph Lauwaert, Geert Willems, Davy Pissoort
Publikováno v:
Microelectronics Reliability. 74:131-135
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (P
Autor:
Conconi, Maria Teresa, Coppi, Paolo De, Bellini, Silvia, Zara, Gabriella, Sabatti, Morena, Marzaro, Maurizio, Franco Zanon, Giovanni, Gamba, Pier Giorgio, Parnigotto, Pier Paolo, Nussdorfer, Gastone Giovanni *
Publikováno v:
In Biomaterials May 2005 26(15):2567-2574
Autor:
Piergiorgio Gamba, Giovanni Franco Zanon, Stefano Giuliani, R. Kiblawi, Paola Midrio, Giulia Ghirardo
Publikováno v:
Pediatric Transplantation. 18:720-725
Lymphocele is a well-known postoperative complication after kidney transplantation. The aim of this study was to analyze time trend incidence, risk factors, and outcome of post-transplant lymphocele in a large pediatric cohort. This is a retrospectiv
Autor:
Mireille Maria Franco Zanon, Gabriel A. R. Melo, Paula Elbl, Peter Löwenberg-Neto, Brunna Maria Setti Ximenes, Priscila Ambrósio Moreira, Isabela Galarda Varassin
Publikováno v:
Acta Botanica Brasilica v.26 n.1 2012
Acta Botanica Brasilica
Sociedade Botânica do Brasil (SBB)
instacron:SBB
Acta Botanica Brasilica
Sociedade Botânica do Brasil (SBB)
instacron:SBB
A atividade dos polinizadores é afetada pela disponibilidade de recursos. Flores que produzem mais néctar podem ser mais visitadas e assim apresentar maior produção de frutos. O efeito da produção de néctar na atividade dos polinizadores foi t
Autor:
Alfredo Berrettini, Giulia Ghirardo, Waifro Rigamonti, Marco Castagnetti, Giovanni Franco Zanon, Evisa Zhapa, Luisa Murer
Publikováno v:
Pediatric Transplantation. 14:859-862
We assessed LUTS at least 12 months after RTx in patients without evidence of lower urinary tract dysfunction (non-urologic) that had been anuric for at least six months before RTx. No bladder recycling was performed before RTx. LUTS were evaluated u
Autor:
Antonio Stocco, Enrico Zanoni, Augusto Tazzoli, Nicolo Ronchi, Gaudenzio Meneghesso, Franco Zanon
Publikováno v:
Microelectronics Reliability. 49:1207-1210
This paper report on the long-term stress (1000 h) carried out on AlGaN/GaN HEMTs processed on composite SopSiC substrate. Almost all tested devices present good device stability and promising performance. The reliability issues identified during the