Zobrazeno 1 - 10 of 31 pro vyhledávání: '"Francis Pressecq"'
1
First potential of nanocomposites for space electronics applications
Autor: O. Vendier, K. Kiryukhina, P. Monfraix, F. Courtade, Francis Pressecq, J. M. Desmarres
Publikováno v: 2016 IEEE Nanotechnology Materials and Devices Conference (NMDC).
This paper presents a few recent development of nanocomposite materials for space applications in electronic interconnection, EMC shielding, and ESD protection.
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::c4e6abefb22e740bf06cb85e55bb9c16
https://doi.org/10.1109/nmdc.2016.7777177
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2
Investigation on the effect of external mechanical stress on the DC characteristics of GaAs microwave devices
Autor: J.-L. Muraro, Francis Pressecq, Kokou Adokanou, Karim Inal, Barbara Bonnet, Pierre Montmitonnet
Publikováno v: Microelectronics Reliability
Microelectronics Reliability, Elsevier, 2015, Proceedings of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis-Proceedings of ESREF 2015, 55 (9-10), pp.1697-1702. ⟨10.1016/j.microrel.2015.06.033⟩
International audience; Stress control is a main factor in the operation, performance and reliability of GaAs devices. A precise understanding of the impact of the mechanical stress on the performance and reliability of GaAs devices can lead to the i
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::79f88cd57c4dd99a2f9f19fe2e9d74ce
https://hal-mines-paristech.archives-ouvertes.fr/hal-01180774
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3
How to evaluate the reliability of MEMS devices without standards
Autor: Francis Pressecq, Djemel Lellouchi, Jérémie Dhennin
Publikováno v: 2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP).
The standard methodologies currently used for lifetime estimation of microelectronics products rely on the combination of consolidated best practice experience and the knowledge of the manufacturing technology. Indeed, the core physics involved in mo
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::9bece55d7a182bdc0f346a90950ea8b7
https://doi.org/10.1109/dtip.2015.7161015
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4
Thermal and electrostatic reliability characterization in RF MEMS switches
Autor: Francis Pressecq, Petra Schmitt, Xavier Lafontan, F. Flourens, Lionel Buchaillot, Patrick Pons, Dominique Collard, Q.H. Duong
Publikováno v: Microelectronics Reliability
Microelectronics Reliability, 2005, 45, pp.1790-1793
Microelectronics Reliability, Elsevier, 2005, 45, pp.1790-1793
The reliability of RF MEMS switches is closely linked to their operational and environmental conditions. This paper examines the reliability of five different capacitive switch designs by a combined use of modeling and experimental tools. Three-dimen
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b2f481c5fa52fea6525f216073af9b32
https://doi.org/10.1016/j.microrel.2005.07.095
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6
The advent of MEMS in space
Autor: J.-L. Roux, Francis Pressecq, C. Le-Touze, J. Kuchenbecker, Muriel Dardalhon, Djemel Lellouchi, B. Baradat, Felix Beaudoin, Xavier Lafontan, Sebastien Rigo, Jean Marc Nicot, Petra Schmitt
Publikováno v: Microelectronics Reliability. 43:1061-1083
An overview of the MEMS activity at the French Space Agency (CNES) is presented. At present, MEMS are in the introduction phase and failure analysis and quality assurance (FA/QA) activities are underway for a large variety of MEMS technologies. This
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::c149eb711f0faf1046ad174e9eeb1af2
https://doi.org/10.1016/s0026-2714(03)00120-3
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8
Characterization and modeling of a CMOS-compatible MEMS technology
Autor: Pascal Nouet, Philippe Hazard, Francis Pressecq, Laurent Latorre, Yves Bertrand
Publikováno v: Sensors and Actuators A: Physical. 74:143-147
In this paper we present a new methodology for efficient electromechanical characterization of a CMOS-compatible micro-electro mechanical sensors (MEMS) technology. Using an original test structure, the so-called `U-shape cantilever beam', we are abl
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::21bc52d325e5f4c18c207f907f7f8e44
https://doi.org/10.1016/s0924-4247(98)00345-8
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9
A new method for hermeticity testing of wafer-level packaging
Autor: Jean-François Le Neal, Jérémie Dhennin, Adrien Broue, David Veyrie, Xavier Lafontan, Francis Pressecq, Djemel Lellouchi
Publikováno v: SPIE Proceedings.
Until now, the determination of the herm eticity of microelectronic packages is related to the MIL-STD-883 method 1014 which is based on the He leak detection method. But this method is no more suited for small packages due to the resolution limit of
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::56350c7852104789e8cc404a82dab040
https://doi.org/10.1117/12.839860
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10
MEMS failure analysis case studies using the IR-OBIRCH method - Short circuit localization in a MEMS pressure sensor
Autor: Francis Pressecq, Felix Beaudoin, Xavier Lafontan, J. Dhennin, Djemel Lellouchi
Publikováno v: 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.
The use of MEMS is becoming more common in consumer products such as game consoles. But for high reliability domains such as space, there is still a long path. Consequently, the support for process and failure analysis of MEMS devices requires adapte
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::a3836dc35ec39444cf2a017f666f6f1c
https://doi.org/10.1109/ipfa.2009.5232714
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