Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Francesco Villasmunta"'
Publikováno v:
2021 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD).
Optical interconnections are a promising step for-ward to overcome the intrinsic limitations of electrical inter-connections in integrated circuits. In this work, we present a finite element method (FEM) simulation study of a dielectric waveguide etc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b54bd5a1d2b9ccc544235b6c02238bf
https://doi.org/10.1109/nusod52207.2021.9541464
https://doi.org/10.1109/nusod52207.2021.9541464
Autor:
Fabio De Matteis, Francesco Villasmunta, Friedhelm Heinrich, Joachim Bauer, Viachaslau Ksianzou, Andreas Mai, Martin Burger, Christian Mai, Birgit Dietzel, Patrick Steglich, Mauro Casalboni, Christoph Zesch, Siegfried Bondarenko, Silvio Pulwer, Paolo Prosposito, Francesco Vitale, Claus Villringer, Sigurd Schrader
Publikováno v:
Journal of Physics: Photonics, 3, 2, Article-Nr. 022009
In recent decades, much research effort has been invested in the development of photonic integrated circuits, and silicon-on-insulator technology has been established as a reliable platform for highly scalable silicon-based electro-optical modulators
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cabd8fdf75e6c3fc4debced4013acd4f
http://hdl.handle.net/2108/272842
http://hdl.handle.net/2108/272842
Autor:
Mohammed Kajjout, charafeddine Jama, Yahia Lemmouchi, Friedhelm Heinrich, Ahmed Mazzah, Francesco Villasmunta, Christian Rolando
Publikováno v:
Reactive and Functional Polymers
Reactive and Functional Polymers, Elsevier, 2019, 134, pp.40-48. ⟨10.1016/j.reactfunctpolym.2018.11.004⟩
Reactive and Functional Polymers, 2019, 134, pp.40-48. ⟨10.1016/j.reactfunctpolym.2018.11.004⟩
Reactive and Functional Polymers, Elsevier, 2019, 134, pp.40-48. ⟨10.1016/j.reactfunctpolym.2018.11.004⟩
Reactive and Functional Polymers, 2019, 134, pp.40-48. ⟨10.1016/j.reactfunctpolym.2018.11.004⟩
The aim of this study was to graft the amine functions on the surface of cellulose acetate (CA) fibers by two kind of plasma processing; namely, inductively coupled plasma (ICP) and radiofrequency plasma, using either NH3/He or mixture of N2/H2 gases
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ae309cd01b3b5c8de70bb6a1b517e54c
https://hal.archives-ouvertes.fr/hal-02411305
https://hal.archives-ouvertes.fr/hal-02411305
Autor:
Francesco Villasmunta, O. Fursenko, Sigurd Schrader, Joachim Bauer, Claus Villringer, Christoph Zesch, Friedhelm Heinrich, Steffen Marschmeyer
Publikováno v:
Journal of Vacuum Science & Technology B. 37:062205
Through Silicon Via (TSV) technology is a key in 3D integration of circuits by the creation of interconnects using vias, which go through the full silicon wafer. Typically, a highly-selective Bosch Si etch process is used. It is characterized by a hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::305cc47e88013313f0e2213096e5bcdd
https://doi.org/10.1116/1.5120617
https://doi.org/10.1116/1.5120617