Zobrazeno 1 - 10
of 22
pro vyhledávání: '"Francesco, Beneventi"'
Autor:
Andrea Borghesi, Carmine Di Santi, Martin Molan, Mohsen Seyedkazemi Ardebili, Alessio Mauri, Massimiliano Guarrasi, Daniela Galetti, Mirko Cestari, Francesco Barchi, Luca Benini, Francesco Beneventi, Andrea Bartolini
Publikováno v:
Scientific Data, Vol 10, Iss 1, Pp 1-10 (2023)
Abstract Supercomputers are the most powerful computing machines available to society. They play a central role in economic, industrial, and societal development. While they are used by scientists, engineers, decision-makers, and data-analyst to comp
Externí odkaz:
https://doaj.org/article/405eefb09aee4dd88afc242bce562535
Autor:
Wissam Abu Ahmad, Andrea Bartolini, Daniele Gregori, Andrea Borghesi, Francesco Beneventi, Marco Cicala, Cosimo Gianfreda, Antonio Libri, Privato Forestieri, Filippo Spiga, Luca Benini, Simone Tinti
Publikováno v:
IPDPS Workshops
none 12 si In this paper we present D.A.V.I.D.E. (Development for an Added Value Infrastructure Designed in Europe), an innovative and energy efficient High Performance Computing cluster designed by E4 Computer Engineering for PRACE (Partnership for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7c038dcf3cdab2d57fec9484e3b44801
http://arxiv.org/abs/2307.05790
http://arxiv.org/abs/2307.05790
Autor:
Mittone, Gianluca, Nicolò, Tonci, Birke, Robert Renè Maria, Colonnelli, Iacopo, Medic, Doriana, Andrea, Bartolini, Esposito, Roberto, Emanuele, Parisi, Francesco, Beneventi, Polato, Mirko, Massimo, Torquati, Luca, Benini, Aldinucci, Marco
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______970::3c0e2ffef98e756f7c4de733c91c3df7
https://hdl.handle.net/2318/1898473
https://hdl.handle.net/2318/1898473
Autor:
Federico Ficarelli, Andrea Bartolini, Emanuele Parisi, Francesco Beneventi, Francesco Barchi, Daniele Gregori, Fabrizio Magugliani, Marco Cicala, Cosimo Gianfreda, Daniele Cesarini, Andrea Acquaviva, Luca Benini
Publikováno v:
Proceedings of the 19th ACM International Conference on Computing Frontiers.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd35a6ff4d5d6fec575662c83a859fca
https://doi.org/10.1145/3528416.3530869
https://doi.org/10.1145/3528416.3530869
Autor:
Daniele Cesarini, Luca Benini, Antonio Libri, Francesco Beneventi, Andrea Bartolini, Carlo Cavazzoni, Andrea Borghesi
Publikováno v:
ICPP Workshops
ACM International Conference Proceeding Series
ICPP 2019: Proceedings of the 48th International Conference on Parallel Processing: Workshops, August 2019
ACM International Conference Proceeding Series
ICPP 2019: Proceedings of the 48th International Conference on Parallel Processing: Workshops, August 2019
ACM International Conference Proceeding Series
ICPP 2019: Proceedings of the 48th International Conference on Parallel Processing: Workshops, August 2019
ISBN:978-1-4503-7196-4
ICPP 2019: Proceedings of the 48th International Conference on Parallel Processing: Workshops, August 2019
ISBN:978-1-4503-7196-4
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::adc13f910765a454c1f33adba80abe64
https://doi.org/10.1145/3339186.3339215
https://doi.org/10.1145/3339186.3339215
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Sygma
Archivio istituzionale della ricerca-Alma Mater Studiorum Università di Bologna
Sygma
Archivio istituzionale della ricerca-Alma Mater Studiorum Università di Bologna
Self-heating and high-operating temperature are major concerns in 3-D-chip integration. In this paper, we leverage a 3-D test chip (WideIO dynamic random access memory on top of a logic die) equipped with temperature sensors and heaters to explore th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::05c1776825da5290899547f30bc39842
https://doi.org/10.1109/tcad.2015.2474382
https://doi.org/10.1109/tcad.2015.2474382
Publikováno v:
HPCS
2018 International Conference on High Performance Computing & Simulation (HPCS)
2018 International Conference on High Performance Computing & Simulation (HPCS)
2018 International Conference on High Performance Computing & Simulation (HPCS)
ISBN:978-1-5386-7879-4
ISBN:978-1-5386-7878-7
ISBN:978-1-5386-7879-4
ISBN:978-1-5386-7878-7
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0f0cc39cb12f9251fc006d419350bcca
https://doi.org/10.1109/hpcs.2018.00058
https://doi.org/10.1109/hpcs.2018.00058
Publikováno v:
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2017
Proceedings of the 2017 Design, Automation and Test in Europe, DATE 2017
DATE
Proceedings of the 2017 Conference and Exhibition on Design, Automation and Test in Europe (DATE)
Sygma
Research Collection
Archivio istituzionale della ricerca-Alma Mater Studiorum Università di Bologna
Proceedings of the 2017 Design, Automation and Test in Europe, DATE 2017
DATE
Proceedings of the 2017 Conference and Exhibition on Design, Automation and Test in Europe (DATE)
Sygma
Research Collection
Archivio istituzionale della ricerca-Alma Mater Studiorum Università di Bologna
Proceedings of the 2017 Conference and Exhibition on Design, Automation and Test in Europe (DATE)
ISBN:978-3-9815370-8-6
ISBN:978-3-9815370-9-3
ISBN:978-3-9815370-8-6
ISBN:978-3-9815370-9-3
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::377daf2d41229a9537b2bd180c06fa28
Publikováno v:
IEEE Transactions on Computers
Aggressive thermal management is a critical feature for high-end computing platforms, as worst-case thermal budgeting is becoming unaffordable. Reactive thermal management, which sets temperature thresholds to trigger thermal capping actions, is too
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::fceacfecce71977d3b9b510704c22293
https://doi.org/10.1109/tc.2012.293
https://doi.org/10.1109/tc.2012.293
Publikováno v:
IECON
Distributed and compact thermal models are at the basis of thermal-aware design and on-line optimization of the cooling effort in future High-Performance Computing systems. These models can be directly extracted from the target device's thermal respo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3faa1999c233b5625d92acf1ef805e13
https://doi.org/10.1109/iecon.2016.7793664
https://doi.org/10.1109/iecon.2016.7793664