X-Ray Photoelectron Spectroscopy Estimation of Cobalt Seed Layer Reactivity Toward Air Exposure: A Challenge?

Autor: Amine Lakhdari, Vincent Mevellec, Arnaud Etcheberry, Mikailou Thiam, Dominique Suhr, Nathalie Simon, Anne-Marie Goncalves, Frédéric Raynal, Louis Caillard, Mathieu Frégnaux

Publikováno v: ECS Transactions
237th ECS Meeting with the 18th International Meeting on Chemical Sensors, IMCS 2020
237th ECS Meeting with the 18th International Meeting on Chemical Sensors, IMCS 2020, 2020, Montreal, Canada. pp.149-156, ⟨10.1149/09701.0149ecst⟩

For the last several generations of CMOS technology, copper has been used widely as an interconnect material in the back end of the line (BEOL). [1] [2] [3] As the current nodes technology are decreasing continuously, several copper scaling challenge

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::82283a0f550fcc1962cf68ca0096e2df
https://doi.org/10.1149/09701.0149ecst

Investigation of Cu/TaN and Co/TaN Barrier-Seed Oxidation by Acidic and Alkaline Copper Electroplating Chemistry for Damascene Applications

Autor: Amine Lakhdari, Frédéric Raynal, Jackie Vigneron, Arnaud Etcheberry, Mikailou Thiam, Louis Caillard

Publikováno v: Journal of The Electrochemical Society
Journal of The Electrochemical Society, Electrochemical Society, 2018, 165 (10), pp.D439-D443. ⟨10.1149/2.0761810jes⟩

International audience

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::50586d832373c6b6dd61f9805e72666a
https://hal.archives-ouvertes.fr/hal-03119379

A novel bottom up fill mechanism for the metallization of advanced node copper interconnects

Autor: Paul Blondeau, Jean-Baptiste Chaumont, Mikailou Thiam, Frédéric Raynal, Dominique Suhr, Vincent Mevellec, Laurianne Religieux

Publikováno v: 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC).

Copper electrodeposition for on-chip interconnection has been widely described in the semiconductor industry. Most copper plating chemistries currently used for copper interconnects are acidic, involving special additives that provide bottom up fill

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::806d408ae5230c8b4ca2d386f9c21a14
https://doi.org/10.1109/iitc-amc.2016.7507725

Cryptography: all-out attacks or how to attack cryptography without intensive cryptanalysis

Autor: Frédéric Raynal, Jean-Baptiste Bedrune, Eric Filiol

Publikováno v: Journal in Computer Virology. 6:207-237

This article deals with operational attacks leaded against cryptographic tools. Problem is approached from several point of view, the goal being always to retrieve a maximum amount of information without resorting to intensive cryptanalysis. Therefor

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::0648a037061707fd75b1acb8768eb728
https://doi.org/10.1007/s11416-008-0117-x

Rootkit modeling and experiments under Linux

Autor: Frédéric Raynal, Éric Lacombe, Vincent Nicomette

Publikováno v: Journal in Computer Virology. 4:137-157

This article deals with rootkit conception. We show how these particular malicious codes are innovative comparing to usual malware like virus, Trojan horses, etc. From that comparison, we introduce a functional architecture for rootkits. We also prop

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::09d3e88b8879b08c1fc650cfaee984cb
https://doi.org/10.1007/s11416-007-0069-6