Copper deposition onto polyetherimide: Interface composition and adhesion.

Autor: Burrell, Michael C., Porta, G. M., Karas, B. R., Foust, D. F., Chera, J. J.

Publikováno v: Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; 1992, Vol. 10 Issue 4, p2752-2757, 6p