Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Foudeh AM"'
Autor:
Lee Y; Department of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea.; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Liu Y; Department of Bioengineering, Stanford University, Stanford, CA, USA.; Department of Biomedical Engineering, National University of Singapore, Singapore, Singapore., Seo DG; Department of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea., Oh JY; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Kim Y; Department of Electrical Engineering, Stanford University, Stanford, CA, USA., Li J; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Kang J; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Kim J; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Mun J; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Foudeh AM; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Bao Z; Department of Chemical Engineering, Stanford University, Stanford, CA, USA. zbao@stanford.edu., Lee TW; Department of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea. twlees@snu.ac.kr.; School of Chemical and Biological Engineering, Seoul National University, Seoul, Republic of Korea. twlees@snu.ac.kr.; Institute of Engineering Research, Research Institute of Advanced Materials, Soft Foundry, Seoul National University, Seoul, Republic of Korea. twlees@snu.ac.kr.
Publikováno v:
Nature biomedical engineering [Nat Biomed Eng] 2023 Apr; Vol. 7 (4), pp. 511-519. Date of Electronic Publication: 2022 Aug 15.
Autor:
Lee Y; Department of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea.; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Liu Y; Department of Bioengineering, Stanford University, Stanford, CA, USA.; Department of Biomedical Engineering, National University of Singapore, Singapore, Singapore., Seo DG; Department of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea., Oh JY; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Kim Y; Department of Electrical Engineering, Stanford University, Stanford, CA, USA., Li J; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Kang J; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Kim J; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Mun J; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Foudeh AM; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Bao Z; Department of Chemical Engineering, Stanford University, Stanford, CA, USA. zbao@stanford.edu., Lee TW; Department of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea. twlees@snu.ac.kr.; School of Chemical and Biological Engineering, Seoul National University, Seoul, Republic of Korea. twlees@snu.ac.kr.; Institute of Engineering Research, Research Institute of Advanced Materials, Soft Foundry, Seoul National University, Seoul, Republic of Korea. twlees@snu.ac.kr.
Publikováno v:
Nature biomedical engineering [Nat Biomed Eng] 2022 Sep; Vol. 6 (9), pp. 1085.
Autor:
Yafia M; School of Engineering, University of British Columbia, Kelowna, BC V1V 1V7, Canada., Foudeh AM; Department of Biomedical Engineering, Faculty of Medicine, McGill University, Montreal, QC H3A 0C7, Canada., Tabrizian M; Department of Biomedical Engineering, Faculty of Medicine, McGill University, Montreal, QC H3A 0C7, Canada.; Faculty of Dentistry, McGill University, Montreal, QC H3A 1G1, Canada., Najjaran H; School of Engineering, University of British Columbia, Kelowna, BC V1V 1V7, Canada.
Publikováno v:
Micromachines [Micromachines (Basel)] 2020 Sep 22; Vol. 11 (9). Date of Electronic Publication: 2020 Sep 22.
Autor:
Foudeh AM; Department of Chemical Engineering, Stanford University, Stanford, CA, 94305, USA., Pfattner R; Department of Chemical Engineering, Stanford University, Stanford, CA, 94305, USA.; Institut de Ciència de Materials de Barcelona (ICMAB-CSIC), Networking Research Center on Bioengineering Biomaterials and Nanomedicine (CIBER-BBN), Campus UAB, Bellaterra, 08193, Spain., Lu S; Department of Chemical Engineering, Stanford University, Stanford, CA, 94305, USA.; Department of Electrical and Computer Engineering, Duke University, Durham, NC, 27708, USA., Kubzdela NS; Department of Chemical Engineering, Stanford University, Stanford, CA, 94305, USA., Gao TZ; Department of Materials Science and Engineering, Stanford University, Stanford, CA, 94305, USA., Lei T; Department of Chemical Engineering, Stanford University, Stanford, CA, 94305, USA.; Department of Materials Science and Engineering, College of Engineering, Peking University, Beijing, 100871, China., Bao Z; Department of Chemical Engineering, Stanford University, Stanford, CA, 94305, USA.
Publikováno v:
Small (Weinheim an der Bergstrasse, Germany) [Small] 2020 Aug; Vol. 16 (34), pp. e2002875. Date of Electronic Publication: 2020 Jul 21.
Autor:
Liu Y; Department of Bioengineering, Stanford University, Stanford, CA, USA., Liu J; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Chen S; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Lei T; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Kim Y; Department of Electrical Engineering, Stanford University, Stanford, CA, USA., Niu S; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Wang H; Department of Bioengineering, Stanford University, Stanford, CA, USA., Wang X; Department of Bioengineering, Stanford University, Stanford, CA, USA., Foudeh AM; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Tok JB; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Bao Z; Department of Chemical Engineering, Stanford University, Stanford, CA, USA. zbao@stanford.edu.
Publikováno v:
Nature biomedical engineering [Nat Biomed Eng] 2019 Jan; Vol. 3 (1), pp. 58-68. Date of Electronic Publication: 2019 Jan 08.
Autor:
Lopez J; Department of Chemical Engineering, Stanford University, CA, 94305, USA., Sun Y; Department of Materials Science and Engineering, Stanford University, CA, 94305, USA., Mackanic DG; Department of Chemical Engineering, Stanford University, CA, 94305, USA., Lee M; Department of Chemical Engineering, Stanford University, CA, 94305, USA., Foudeh AM; Department of Chemical Engineering, Stanford University, CA, 94305, USA., Song MS; Department of Materials Science and Engineering, Stanford University, CA, 94305, USA.; Energy Material Lab, Material Research Center, Samsung Advanced Institute of Technology, Samsung Electronics, 130 Samsung-ro, Yeongtong-gu, Suwong-si, Gyeonggi-do, 16678, Republic of Korea., Cui Y; Department of Materials Science and Engineering, Stanford University, CA, 94305, USA.; Stanford Institute for Materials and Energy Sciences, SLAC National Accelerator Laboratory, Menlo Park, CA, 94025, USA., Bao Z; Department of Chemical Engineering, Stanford University, CA, 94305, USA.
Publikováno v:
Advanced materials (Deerfield Beach, Fla.) [Adv Mater] 2018 Oct; Vol. 30 (43), pp. e1804142. Date of Electronic Publication: 2018 Sep 10.
Autor:
Kim Y; Department of Electrical Engineering, Stanford University, Stanford, CA, USA., Chortos A; Department of Materials Science and Engineering, Stanford University, Stanford, CA, USA., Xu W; Department of Materials Science and Engineering, Seoul National University, Seoul, South Korea. wentao@nankai.edu.cn zbao@stanford.edu twlees@snu.ac.kr.; Institute of Photoelectronic Thin Film Devices and Technology, Nankai University, Tianjin, China., Liu Y; Department of Bioengineering, Stanford University, Stanford, CA, USA., Oh JY; Department of Chemical Engineering, Stanford University, Stanford, CA, USA.; Department of Chemical Engineering, Kyung Hee University, Yongin, South Korea., Son D; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Kang J; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Foudeh AM; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Zhu C; Department of Electrical Engineering, Stanford University, Stanford, CA, USA., Lee Y; Department of Materials Science and Engineering, Seoul National University, Seoul, South Korea., Niu S; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Liu J; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Pfattner R; Department of Chemical Engineering, Stanford University, Stanford, CA, USA., Bao Z; Department of Chemical Engineering, Stanford University, Stanford, CA, USA. wentao@nankai.edu.cn zbao@stanford.edu twlees@snu.ac.kr., Lee TW; Department of Materials Science and Engineering, Seoul National University, Seoul, South Korea. wentao@nankai.edu.cn zbao@stanford.edu twlees@snu.ac.kr.
Publikováno v:
Science (New York, N.Y.) [Science] 2018 Jun 01; Vol. 360 (6392), pp. 998-1003.
Autor:
Wang S; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA., Xu J; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA., Wang W; Department of Materials Science and Engineering, Stanford University, Stanford, California 94305, USA., Wang GN; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA., Rastak R; Department of Civil and Environmental Engineering, Stanford University, Stanford, California 94305, USA., Molina-Lopez F; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA., Chung JW; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA.; Samsung Advanced Institute of Technology, Yeongtong-gu, Suwon-si, Gyeonggi-do 443-803, Republic of Korea., Niu S; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA., Feig VR; Department of Materials Science and Engineering, Stanford University, Stanford, California 94305, USA., Lopez J; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA., Lei T; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA., Kwon SK; Department of Materials Engineering and Convergence Technology and ERI, Gyeongsang National University, Jinju, 660-701, Republic of Korea., Kim Y; Department of Electrical Engineering, Stanford University, Stanford, California 94305, USA., Foudeh AM; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA., Ehrlich A; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA., Gasperini A; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA., Yun Y; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA.; Samsung Advanced Institute of Technology, Yeongtong-gu, Suwon-si, Gyeonggi-do 443-803, Republic of Korea., Murmann B; Department of Electrical Engineering, Stanford University, Stanford, California 94305, USA., Tok JB; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA., Bao Z; Department of Chemical Engineering, Stanford University, Stanford, California 94305, USA.
Publikováno v:
Nature [Nature] 2018 Mar 01; Vol. 555 (7694), pp. 83-88. Date of Electronic Publication: 2018 Feb 19.
Autor:
Foudeh AM; Department of Biomedical Engineering, Faculty of Medicine, McGill University, 3775 University Street, Montreal, QC, H3A 2B4, Canada., Trigui H, Mendis N, Faucher SP, Veres T, Tabrizian M
Publikováno v:
Analytical and bioanalytical chemistry [Anal Bioanal Chem] 2015 Jul; Vol. 407 (18), pp. 5541-5. Date of Electronic Publication: 2015 May 03.
Autor:
Foudeh AM; 3775 University Street, Department of Biomedical Engineering, Faculty of Medicine, McGill University H3A 2B4, Montreal, (QC), Canada., Brassard D, Tabrizian M, Veres T
Publikováno v:
Lab on a chip [Lab Chip] 2015 Mar 21; Vol. 15 (6), pp. 1609-18.