Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Foong, Chee Seng"'
Autor:
Zaliman Sauli, Tan Chou Yong, Noor Azrina Talik, Vithyacharan Retnasamy, Yap Boon Kar, Foong Chee Seng
Publikováno v:
Microelectronics International. 30:99-103
PurposeThis paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment process, could affect the pa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5f4235c5f40aa9efe7f724fa7ab265b
https://doi.org/10.1108/13565361311314502
https://doi.org/10.1108/13565361311314502
Publikováno v:
Microelectronics Reliability. 49:537-543
This study investigates the effects of two different catalytic activation techniques on the thermal performance of the flip-chip heat spreaders. The two activation techniques studied are thin nickel–copper strike and galvanic initiation. Thermal di
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2947568d2d063f25677ede9960f84dec
https://doi.org/10.1016/j.microrel.2009.02.013
https://doi.org/10.1016/j.microrel.2009.02.013
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
The current market trend for chip on chip connection is mainly using copper pillar. The copper pillar technology has been around for many years and advances in the copper pillar technology have grown steadily over the past few years. The main issue w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3afe7bda9553b60541d72c45001b3834
https://doi.org/10.1109/eptc.2015.7412297
https://doi.org/10.1109/eptc.2015.7412297
Publikováno v:
Journal of Heat Transfer; 20240101, Issue: Preprints
Autor:
Yap Boon Kar, R. Vithyacharan, Foong Chee Seng, Leong Hung Yang, Tan Chou Yong, Noor Azrma Tahk
Publikováno v:
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC).
This paper discusses the evaluation and characterizations of the cleaning the organic residues on Flip Chip Ceramic Ball Grid Array (FCCBGA) package. Flux used for Control Collapse Chip Connection (C4) die attachment during assemblies could remain on
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::668f5c928085a13872f91aa1cc9c3fb2
https://doi.org/10.1109/eptc.2012.6507154
https://doi.org/10.1109/eptc.2012.6507154
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
As the semiconductor packaging industry continues to lower its manufacturing costs, concerted efforts in the supply chain focusing on using copper (Cu) as wire bond interconnects has intensified to an unprecedented level. In our previous study we sho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d11ac5afd3cfe03577ff356330eb02d4
https://doi.org/10.1109/eptc.2011.6184522
https://doi.org/10.1109/eptc.2011.6184522
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
Package warpage or generally referred to as plastic package deformation has become more challenging with larger and thinner package body sizes. The detrimental effects of the package warpage are more prominent in peripheral packages with leads such a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0c2b7327a3b50d01eea9930dde2535d
https://doi.org/10.1109/iemt.2010.5746703
https://doi.org/10.1109/iemt.2010.5746703
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
In this paper, we discuss a unique combination of experimental analyses employed to monitor, understand, and ultimately eliminate micro voids formation in the epoxy matrix of flip chip underfill during curing. Present day flip chip packages require t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ec818b2e1e97ae979f8cd98a0312553
https://doi.org/10.1109/eptc.2009.5416487
https://doi.org/10.1109/eptc.2009.5416487
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
This paper presents the effects of two different catalytic activation techniques on the thermal performance of flip chip heat spreaders. The two activation techniques investigated are i) thin nickel-copper strike and ii) galvanic initiation. Thermal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5266047aff041d9e1215f442efd71bc
https://doi.org/10.1109/iemt.2008.5507785
https://doi.org/10.1109/iemt.2008.5507785
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference; 1/ 1/2011, p764-768, 5p