Zobrazeno 1 - 10
of 218
pro vyhledávání: '"Fong Shu"'
Autor:
FONG SHU LIN, 馮淑鈴
96
The middle and small business always play important roles in the track of our country’s development. Because of government policy to facilitate accommodation of middle and small business, the amount of bank loans to middle and small busines
The middle and small business always play important roles in the track of our country’s development. Because of government policy to facilitate accommodation of middle and small business, the amount of bank loans to middle and small busines
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/70487685411546191557
Autor:
Min-Fong Shu, Yi-Hsiu Tseng
Publikováno v:
International Symposium on Microelectronics. 2018:000161-000166
Copper oxidation structure, cupric oxide (CuO) and cuprous oxide (Cu2O), under Ar/H2 plasma reaction mechanism for the EMC/Cu interface adhesion improvement was studied in this work. This work is utilized TGA to figure out Cu oxidized state and sampl
Publikováno v:
International Symposium on Microelectronics. 2018:000146-000152
In flip chip assembly, the smaller solder ball is used in chip and substrate joint. This may have an adverse influence on the reliability of electronic products. Thus, the mechanical strength of solder joint is an important topic for the major reliab
Publikováno v:
Journal of Nanoscience and Nanotechnology. 17:8890-8893
Autor:
Fong, Shu-Yi, 馮書儀
107
Based on the research discussing the motivation for company to go private, we tried to examine if factors related to country risk and industrial characteristics would have impact on the announcement effect of going private from the point of
Based on the research discussing the motivation for company to go private, we tried to examine if factors related to country risk and industrial characteristics would have impact on the announcement effect of going private from the point of
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/zgkf6g
Akademický článek
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Publikováno v:
2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Cupric oxide reduction mechanism under H 2 /Ar plasma treatment and its effect on EMC/LF adhesion characterization was studied in this paper. The relationship of the adhesion force between EMC/LF and different baking conditions was measured, and the
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC).
A quad flat no-lead (QFN) package delamination improvement and its related lead-frame (LF) copper oxidation effect were studied. Pudding mold adhesion testing method was utilized to determine the epoxy molding compound (EMC)/LF interfacial adhesion p
Autor:
Ching-Fong Shu, Chin-Hung Lai, Pi-Tai Chou, Fang-Ming Hsu, Kangwei Wang, Chen-Han Chien, Cheng-Chih Hsieh
Publikováno v:
Advanced Functional Materials. 19:2834-2843
Highly efficient blue electrophosphorescent organic light-emitting diodes incorporating a bipolar host, 2,7-bis(diphenylphosphoryl)-9-[4-(N,N-diphenylamino)phenyl]-9-phenylfluorene (POAPF), doped with a conventional blue triplet emitter, iridium(III)
Publikováno v:
Organic Electronics. 10:871-876
We have prepared efficient red organic light-emitting diodes (OLEDs) incorporating 2,7-bis(diphenylphosphoryl)-9-[4-(N,N-diphenylamino)phenyl]-9-phenylfluorene (POAPF) as the host material doped with the osmium phosphor Os(fptz)2(PPh2Me)2 (fptz = 3-t