Zobrazeno 1 - 10
of 35
pro vyhledávání: '"Folke Dencker"'
Autor:
Eckhard Kirchner, Thomas Wallmersperger, Thomas Gwosch, Johannes D. M. Menning, Julian Peters, Richard Breimann, Benjamin Kraus, Peter Welzbacher, Jan Küchenhof, Dieter Krause, Erich Knoll, Michael Otto, Benjamin Muhammedi, Stephanie Seltmann, Alexander Hasse, Günter Schäfer, Armin Lohrengel, Stefan Thielen, Yvo Stiemcke, Oliver Koch, Arthur Ewert, Thomas Rosenlöcher, Berthold Schlecht, Artem Prokopchuk, Ernst‐Friedrich Markus Henke, Felix Herbst, Sven Matthiesen, David Riehl, Ferdinand Keil, Klaus Hofmann, Florian Pape, Dennis Konopka, Gerhard Poll, Tobias Steppeler, Rico Ottermann, Folke Dencker, Marc C. Wurz, Steffen Puchtler, Thao Baszenski, Martin Winnertz, Georg Jacobs, Benjamin Lehmann, Karsten Stahl
Publikováno v:
Advanced Sensor Research, Vol 3, Iss 4, Pp n/a-n/a (2024)
Abstract This contribution summarizes the current state of research regarding so‐called sensor‐integrating machine elements as an enabler of digitalization in mechanical engineering and——if available—their application in industry. The focus
Externí odkaz:
https://doaj.org/article/1507e9a770044e00bb58008ce1c9cac3
Autor:
Selina Raumel, Khemais Barienti, Hoang-Thien Luu, Nina Merkert, Folke Dencker, Florian Nürnberger, Hans Jürgen Maier, Marc Christopher Wurz
Publikováno v:
Friction, Vol 11, Iss 8, Pp 1505-1521 (2023)
Abstract Engineering in vacuum or under a protective atmosphere permits the production of materials, wherever the absence of oxygen is an essential demand for a successful processing. However, very few studies have provided quantitative evidence of t
Externí odkaz:
https://doaj.org/article/1a25c51cdc014c52bc656d8fdc94d48d
Publikováno v:
Journal of Materials Research and Technology, Vol 20, Iss , Pp 1828-1838 (2022)
Due to the complex mechanisms, the ultrasonic (US) wire bonding process is usually optimized in the way of varying the processing parameters including normal force, US power, and processing time. In this study, a new way by creating different surface
Externí odkaz:
https://doaj.org/article/6be181aef2c54826afffbe2969be7220
Autor:
Christian-G. R. Wittek, Lukas Steinhoff, Selina Raumel, Michael Reißfelder, Folke Dencker, Marc C. Wurz
Publikováno v:
Micromachines, Vol 14, Iss 3, p 580 (2023)
Downsized and complex micro-machining structures have to meet quality requirements concerning geometry and convince through increasing functionality. The development and use of cutting tools in the sub-millimeter range can meet these demands and cont
Externí odkaz:
https://doaj.org/article/67c49d7e47e64c23babba199b17b31fc
Publikováno v:
Machines, Vol 10, Iss 10, p 870 (2022)
In the context of intelligent components in industrial applications in the automotive, energy or construction sector, sensor monitoring is crucial for security issues and to avoid long and costly downtimes. This article discusses component-inherent t
Externí odkaz:
https://doaj.org/article/ef7b7768dc29419984b1044e9c6435ea
Publikováno v:
Sensors, Vol 20, Iss 11, p 3294 (2020)
New sensor and sensor manufacturing technologies are identified as a key factor for a successful digitalisation and are therefore economically important for manufacturers and industry. To address various requirements, a new sputter coating system has
Externí odkaz:
https://doaj.org/article/d39dd9fb3b1041e4842a1e453cc41456
Publikováno v:
Tribologie und Schmierungstechnik. 70:5-10
As copper is a rather difficult material to machine due to its ductility compared to aluminium, this study presents the approach of oxidizing the surface to improve the results of the grinding process. Therefore, batch manufactured flexible micro-gri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b9a652a8a4dd64b9841e2f773d1a27bb
https://doi.org/10.24053/tus-2023-0002
https://doi.org/10.24053/tus-2023-0002
Autor:
Rico Ottermann, Shuowen Zhang, Berend Denkena, Heinrich Klemme, Dennis Kowalke, Michael Korbacher, Folke Dencker, Marc Christopher Wurz
Publikováno v:
2022 IEEE Sensors.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5911f9917a01f7aafc18263b5c1c6ce7
https://doi.org/10.1109/sensors52175.2022.9967357
https://doi.org/10.1109/sensors52175.2022.9967357
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85b0abec2de0257a75bbd836fa33260c
https://doi.org/10.1109/estc55720.2022.9939495
https://doi.org/10.1109/estc55720.2022.9939495
Publikováno v:
Journal of Materials Processing Technology. 312:117826
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::608636c1267390f0d52bfa7e587a4b80
https://doi.org/10.1016/j.jmatprotec.2022.117826
https://doi.org/10.1016/j.jmatprotec.2022.117826