Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Floriane Baudin"'
Autor:
Mohamed Rayane Bani, Romain Crochemore, Floriane Baudin, Cassandre Beluffi, Catherine Euvrard-Colnat, Sebastien Dominguez, Guillaume Rodriguez, Richard Souil, Remi Velard, Jean Charbonnier, Edouard Deschaseaux, Candice Thomas
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f4b455495b68560e11e585cd4fd1b72f
https://doi.org/10.1109/estc55720.2022.9939538
https://doi.org/10.1109/estc55720.2022.9939538
Autor:
Thomas Signamarcheix, Thomas Lacave, Gweltaz Gaudin, Mariam Sadaka, Lea Di Cioccio, Ionut Radu, Floriane Baudin
Publikováno v:
ECS Transactions. 58:17-28
3D integration aims at providing highly integrated systems by vertically stacking and connecting various materials, technologies, and functional components together. We will review the different approaches, using direct bonding, developed to address
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d6e19d48f98ea0ac13bddc4d4e49bd0
https://doi.org/10.1149/05809.0017ecst
https://doi.org/10.1149/05809.0017ecst
Autor:
Cyril Guedj, Nicolas Chevalier, Bruno Imbert, Jean-Marc Fabbri, Floriane Baudin, L. Di Cioccio, D. Mariolle, V. Delaye, Yves Bréchet
Publikováno v:
ECS Transactions. 50:125-132
Direct metal bonding represents an advanced joining technology that allows vertical stacking with electrical conduction and even heat dissipation. For most metals used as bonding layers, direct bonding when operating at ambient air involves metal oxi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9a1b734a492ad341e12fd270d2cb96ec
https://doi.org/10.1149/05007.0125ecst
https://doi.org/10.1149/05007.0125ecst
Autor:
Mariolle Denis, Stephane Thieffry, Nicolas Chevalier, Ionut Radu, Bruno Imbert, Frederic Mazen, Thomas Signamarcheix, Floriane Baudin, Lea Di Cioccio, Angelique Mounier, Vincent Delaye, Gweltaz Gaudin, Thomas Lacave
Publikováno v:
ECS Transactions. 50:169-175
While significant research effort on various planar approaches, the 3D vertical IC stacking is undoubtedly gaining increasing momentum as a leading contender in the challenge to meet performance, cost, and size demands through this decade and beyond.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c77f355addb5fb55ffe7a7d8430f732
https://doi.org/10.1149/05007.0169ecst
https://doi.org/10.1149/05007.0169ecst
Autor:
Yves Bréchet, E. Martinez, Floriane Baudin, L. Di Cioccio, Vincent Delaye, Nicolas Chevalier, Jerome Dechamp, Hubert Moriceau
Publikováno v:
Microsystem Technologies
Microsystem Technologies, Springer Verlag, 2013, 19 (5), pp.647-653. ⟨10.1007/s00542-012-1664-0⟩
Microsystem Technologies, 2013, 19 (5), pp.647-653. ⟨10.1007/s00542-012-1664-0⟩
Microsystem Technologies, Springer Verlag, 2013, 19 (5), pp.647-653. ⟨10.1007/s00542-012-1664-0⟩
Microsystem Technologies, 2013, 19 (5), pp.647-653. ⟨10.1007/s00542-012-1664-0⟩
International audience; Direct metal bonding is a key technology for 3D integration that will allow semiconductor industry to go beyond predicted problems of future ICs. In this paper, for the first time, we show room temperature direct bonding of ti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::781f0fb1b0123539cd8244b10208f328
https://doi.org/10.1007/s00542-012-1664-0
https://doi.org/10.1007/s00542-012-1664-0
Autor:
Lea Di Cioccio, Vincent Delaye, Floriane Baudin, Pierre-Henri Jouneau, Thomas Signamarcheix, François Rieutord, Patrice Gergaud
Publikováno v:
ECS Transactions
ECS Transactions, Electrochemical Society, Inc., 2014, 64 (5), pp.339-355. ⟨10.1149/06405.0339ecst⟩
ECS Transactions, 2014, 64 (5), pp.339-355. ⟨10.1149/06405.0339ecst⟩
ECS Transactions, Electrochemical Society, Inc., 2014, 64 (5), pp.339-355. ⟨10.1149/06405.0339ecst⟩
ECS Transactions, 2014, 64 (5), pp.339-355. ⟨10.1149/06405.0339ecst⟩
Metal layer bonding is nowadays at the center of the latest wafer bonding researches. This technology enables innovative architectures in 3D, LED’s, MeM’s and Power devices. Unlike other metal bonding techniques, the non-thermo compression metal-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3b71755cc7a15a928dcd4342b196c4fb
https://hal.univ-grenoble-alpes.fr/hal-02016543
https://hal.univ-grenoble-alpes.fr/hal-02016543
Autor:
Yann Beilliard, Floriane Baudin, Stephane Moreau, L. Sanchez, Pierric Gueguen, Rachid Taibi, Sébastien Mermoz, Lea Di Cioccio
Publikováno v:
Handbook of 3D Integration
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::429cf21f9008dbc8d181a0fb14f9f585
https://doi.org/10.1002/9783527670109.ch22
https://doi.org/10.1002/9783527670109.ch22
Publikováno v:
MRS Proceedings. 1559
Wafer level metal bonding involving copper material is widely used to achieve 3D functional integration of ICs and ensure effective packaging sealing for various applications. In this paper we focus on thermocompression bonding technology where tempe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::134f99cea2fb37fa392ca80afb253e7e
https://doi.org/10.1557/opl.2013.718
https://doi.org/10.1557/opl.2013.718
Autor:
Lea Di Cioccio, Ionut Radu, Gweltaz Gaudin, Thomas Lacave, Floriane Baudin, Mariam Sadaka, Thomas Signamarcheix
Publikováno v:
ECS Meeting Abstracts. :2215-2215
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::869a9c9cbab80c7d2a82087e2858fdd2
https://doi.org/10.1149/ma2013-02/33/2215
https://doi.org/10.1149/ma2013-02/33/2215
Autor:
Floriane Baudin, Léa Di Cioccio, Patrice Gergaud, Nicolas Chevalier, Vincent Delaye, Denis Mariolle, Jean-Marc Fabbri, Bruno Imbert, Yves Bréchet
Publikováno v:
ECS Meeting Abstracts. :2965-2965
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::447b1824496399dbfacc9b186835026e
https://doi.org/10.1149/ma2012-02/40/2965
https://doi.org/10.1149/ma2012-02/40/2965