Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Florian Darve"'
Autor:
Juergen Schloeffel, Cristiano Santos, Alexandre Arriordaz, Lee Wang, Yvain Thonnart, Christian Bernard, Eric Flamand, Abbas Sheibanyrad, Frédéric Pétrot, Fabien Clermidy, S. Cheramy, Edith Beigne, Romain Lemaire, Denis Dutoit, Pascal Vivet, Didier Lattard, Florian Darve, Ivan Miro-Panades, Jean Michailos
Publikováno v:
IEEE Journal of Solid-State Circuits
IEEE Journal of Solid-State Circuits, 2016, 52 (1), pp.33-49. ⟨10.1109/JSSC.2016.2611497⟩
IEEE Journal of Solid-State Circuits, Institute of Electrical and Electronics Engineers, 2016, 52 (1), pp.33-49. ⟨10.1109/JSSC.2016.2611497⟩
IEEE Journal of Solid-State Circuits, 2016, 52 (1), pp.33-49. ⟨10.1109/JSSC.2016.2611497⟩
IEEE Journal of Solid-State Circuits, Institute of Electrical and Electronics Engineers, 2016, 52 (1), pp.33-49. ⟨10.1109/JSSC.2016.2611497⟩
International audience; Future many cores, either for high performance computing or for embedded applications, are facing the powerwall, and cannot be scaled up using only the reduction of technology nodes; 3D integration, using through siliconvia (T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::74c17aea1b2ae9d9edf7df966c526039
https://hal.sorbonne-universite.fr/hal-01447433
https://hal.sorbonne-universite.fr/hal-01447433
Autor:
Jean Michailos, Didier Lattard, Cristiano Santos, Yvain Thonnart, Fabien Clermidy, Romain Lemaire, Frédéric Pétrot, Severine Cheramy, Ivan Miro-Panades, Florian Darve, Christian Bernard, Pascal Vivet, Eric Flamand, Edith Beigne
Publikováno v:
ISSCC
By shortening communication distance across dies, 3D technologies are a key to continued improvements in computing density. For 4G telecom baseband processing, specific computing units arranged in a regular network-on-chip (NoC) array provide power-e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::540d860c3ea21de6df8230acedb6237a
https://doi.org/10.1109/isscc.2016.7417949
https://doi.org/10.1109/isscc.2016.7417949
Publikováno v:
DATE
3D technologies using Through Silicon Vias (TSV) have not yet proved their viability for being deployed in large-range products. In this paper, we investigate three promising perspectives for short to medium terms adoption of such technology in high-
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::95a0a9a82d6af2457419f20c07788f87
https://doi.org/10.1109/date.2011.5763213
https://doi.org/10.1109/date.2011.5763213