Zobrazeno 1 - 10
of 77
pro vyhledávání: '"Flachowsky, S."'
Publikováno v:
In Solid State Electronics October 2013 88:27-31
Autor:
Flachowsky, S., Wei, A., Herrmann, T., Illgen, R., Horstmann, M., Richter, R., Salz, H., Klix, W., Stenzel, R.
Publikováno v:
In Materials Science & Engineering B 2008 154:98-101
Autor:
Mueller, S., Slesazeck, S., Henker, S., Flachowsky, S., Polakowski, P., Paul, J., Smith, E., Müller, J., Mikolajick, T.
With the discovery of ferroelectric hafnium oxide (FE-HfO2), the ferroelectric field effect transistor (FeFET), a long-term contender for non-volatile data storage, has finally managed to scale to the 2x nm technology node. Here for the first time, w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::05152937a47f72fed509a8db87ab2f7d
https://publica.fraunhofer.de/handle/publica/244281
https://publica.fraunhofer.de/handle/publica/244281
Autor:
Muller, J., Polakowski, P., Muller, S., Mulaosmanovic, H., Ocker, J., Mikolajick, T., Slesazeck, S., Flachowsky, S., Trentzsch, M.
Publikováno v:
2016 16th Non-Volatile Memory Technology Symposium (NVMTS); 2016, p1-7, 7p
Publikováno v:
2015 Joint IEEE International Symposium on the Applications of Ferroelectric (ISAF), International Symposium on Integrated Functionalities (ISIF) & Piezoelectric Force Microscopy Workshop (PFM); 2015, p233-236, 4p
Autor:
Mueller, S., Slesazeck, S., Henker, S., Flachowsky, S., Polakowski, P., Paul, J., Smith, E., Müller, J., Mikolajick, T.
Publikováno v:
Ferroelectrics; 2016, Vol. 497 Issue 1, p42-51, 10p
Autor:
Flachowsky, S., Herrmann, T., Hontschel, J., Illgen, R., Ong, Shiang Yang, Wiatr, M., Baldauf, T., Klix, W., Stenzel, R.
Publikováno v:
2012 13th International Conference on Ultimate Integration on Silicon (ULIS); 1/ 1/2012, p5-8, 4p
Autor:
Baldauf, T., Wei, A., Herrmann, T., Flachowsky, S., Illgen, R., Hontschel, J., Horstmann, M., Klix, W., Stenzel, R.
Publikováno v:
2011 Semiconductor Conference Dresden (SCD); 2011, p1-4, 4p
Autor:
Baldauf, T., Wei, A., Illgen, R., Flachowsky, S., Herrmann, T., Feudel, T., Ho?ntschel, J., Horstmann, M., Klix, W., Stenzel, R.
Publikováno v:
2011 12th International Conference on Ultimate Integration on Silicon (ULIS); 2011, p1-4, 4p
Autor:
Flachowsky, S., Hontschel, J., Wei, A., Illgen, R., Hermann, P., Herrmann, T., Klix, W., Stenzel, R., Ramirez, A., Horstmann, M., Kernevez, N., Cayrefourcq, I., Metral, F., Kennard, M., Guiot, E.
Publikováno v:
2009 10th International Conference on Ultimate Integration of Silicon; 2009, p161-164, 4p