Zobrazeno 1 - 10
of 64
pro vyhledávání: '"Firiti, A."'
Publikováno v:
In Microelectronics Reliability November 2023 150
Publikováno v:
In Solid State Electronics 2008 52(10):1550-1554
Publikováno v:
In Microelectronics Reliability 2008 48(8):1529-1532
Publikováno v:
In Microelectronics Reliability 2007 47(9):1609-1613
Publikováno v:
In Microelectronics Reliability 2005 45(9):1465-1470
Publikováno v:
International Symposium for Testing and Failure Analysis.
The application of IR-Lock-In Thermography (IRLIT) has been extended from 2D and 3D package fault isolation to on-die level analysis. In addition, the technique has become more sensitive allowing for detection of much lower dissipated power. In this
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d6ca682993015f401aad37611b2d6f8
https://doi.org/10.31399/asm.cp.istfa2019p0104
https://doi.org/10.31399/asm.cp.istfa2019p0104
Publikováno v:
In Microelectronics Reliability 2003 43(9):1681-1686
Autor:
Firiti, A., Faujour, D., Haller, G., Moragues, J.M., Goubier, V., Perdu, P., Beaudoin, F., Lewis, D.
Publikováno v:
In Microelectronics Reliability 2003 43(9):1563-1568
Autor:
Orla O'Halloran, Nicolas Cannesan, Abdellatif Firiti, Peter Sun, Cheng Fu Yu, Zemre Acar, Yuan Wen Hao, Johan Tsai, Sharon Chen, Jyun Ji Chen, Ni Hsing Lee
Publikováno v:
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).
The Ball grid array (BGA) product fixed on the PCB under Highly Accelerated Stress Test (HAST) reliability test and its relevant corrosion phenomenon are reported. In this article, BGA performed HAST with the socket which individually interconnect be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e409676f42e112122590adccba5a884b
https://doi.org/10.1109/eptc.2016.7861537
https://doi.org/10.1109/eptc.2016.7861537
Autor:
Philippe Perdu, Abdellatif Firiti, Olivier Crepel, Magdalena Sienkiewicz, Kevin Sanchez, Dean Lewis
Publikováno v:
Microelectronics Reliability. 48:1529-1532
The mixed-mode ICs (Integrated Circuits), by involving multiple functions (digital, analog, RF, power) inside one device, are becoming more compact and useful. At the same time, their developments and Failure Analysis (FA) are more and more complex:
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cd8504515578e0d40bce28b1666bede5
https://doi.org/10.1016/j.microrel.2008.07.060
https://doi.org/10.1016/j.microrel.2008.07.060