Zobrazeno 1 - 10
of 49
pro vyhledávání: '"Fiori, Vincent"'
Publikováno v:
In Microelectronics Reliability August 2016 63:90-96
Autor:
Gallois-Garreignot, Sébastien, Benzima, Naceur, Benmussa, Etienne, Moutin, Caroline, Bouchard, Pierre-Olivier, Fiori, Vincent, Tavernier, Clément
Publikováno v:
In Microelectronics Reliability May 2015 55(6):980-989
Autor:
Vianne, Benjamin, Bar, Pierre, Fiori, Vincent, Gallois-Garreignot, Sébastien, Ewuame, Komi Atchou, Chausse, Pascal, Escoubas, Stéphanie, Hotellier, Nicolas, Thomas, Olivier
Publikováno v:
In Microelectronics Reliability April 2015 55(5):738-746
Publikováno v:
MRS Spring meeting, Symposium NM2 on “Nanoscale Heat Transfer – From fundamentals to devices”
MRS Spring meeting, Symposium NM2 on “Nanoscale Heat Transfer – From fundamentals to devices”, Apr 2017, Phoenix, United States
MRS Spring meeting, Symposium NM2 on “Nanoscale Heat Transfer – From fundamentals to devices”, Apr 2017, Phoenix, United States
International audience
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::9c928adc2ba3432063b9ae2d4231fbcd
https://hal.archives-ouvertes.fr/hal-01932659
https://hal.archives-ouvertes.fr/hal-01932659
Publikováno v:
United States, Patent n° : US2015200151. 2014
A device includes a support, a three-dimensional integrated structure above the support, and a lateral encapsulation region arranged around the structure. The lateral encapsulation region includes first channels configured to make it possible to circ
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::6758e332437afe962c65c7463320e22f
https://hal-mines-paristech.archives-ouvertes.fr/hal-01803489
https://hal-mines-paristech.archives-ouvertes.fr/hal-01803489
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
K zobrazení výsledku je třeba se přihlásit.
K zobrazení výsledku je třeba se přihlásit.
Publikováno v:
ARCSIS Micropackaging Days Thin and Flexible Packaging 2009
ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France
ARCSIS Micropackaging Days Thin and Flexible Packaging 2009, Oct 2009, Gardanne, France
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::16ddbff8bd626eb0e1d5224ca4600aad
https://hal-emse.ccsd.cnrs.fr/emse-00470630
https://hal-emse.ccsd.cnrs.fr/emse-00470630
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC); 2016, p1-6, 6p
Autor:
Sart, Clement, Estevez, Rafael, Fiori, Vincent, Lhostis, Sandrine, Parry, Guillaume, Gonella, Roberto
Publikováno v:
2016 17th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2016, p1-8, 8p
Publikováno v:
2016 17th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2016, p1-5, 5p