Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Finn Kraemer"'
Publikováno v:
ECOC
2018 European Conference on Optical Communication (ECOC)
2018 European Conference on Optical Communication, ECOC 2018
2018 European Conference on Optical Communication (ECOC)
2018 European Conference on Optical Communication, ECOC 2018
Through a single optical interface, a $250\ \mu m$ pitch two-dimensional $2\times 8$ -channel optical transceiver is integrated on a lithographically patterned silicon interposer, offering 200 Gb/s data input and output duplex within an area of $6\ m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d3de81774ec4e538272aec00b0e6775c
https://doi.org/10.1109/ecoc.2018.8535470
https://doi.org/10.1109/ecoc.2018.8535470
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
Proceedings-IEEE 68th Electronic Components and Technology Conference, ECTC 2018, 848-853
STARTPAGE=848;ENDPAGE=853;TITLE=Proceedings-IEEE 68th Electronic Components and Technology Conference, ECTC 2018
Proceedings-IEEE 68th Electronic Components and Technology Conference, ECTC 2018, 848-853
STARTPAGE=848;ENDPAGE=853;TITLE=Proceedings-IEEE 68th Electronic Components and Technology Conference, ECTC 2018
In this paper, based on a wet etched silicon interposer, we propose a 2.5D assembly of two dimensional optical transceivers for 400 Gbps parallel optical interconnections. In this opto-electronic packaging, two dimensional optical matrix is formed as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0acc665d01156d2f05ef857ac0e1d749
https://research.tue.nl/en/publications/6a2fcbad-4c77-4db0-b6b1-753a6ea2bbf8
https://research.tue.nl/en/publications/6a2fcbad-4c77-4db0-b6b1-753a6ea2bbf8
Autor:
Finn Kraemer, S. B. Christensen, H. Lysdal, Kevin A. Williams, H.J.S. Dorren, Jeroen Antonius Maria Duis, Barry Smalbrugge, Sander Dorrestein, Pinxiang Duan, Oded Raz, D. Molin, P. Sillard, G. Kuyt
Publikováno v:
2013 Optical Interconnects Conference.
We demonstrate a wafer-scale process for making compact 3D stacked 10×10 Gbps transmitter chips. Error-free operation is obtained for 0 and 500 meter transmission in OM4-Plus fiber with a maximum 1.4 dB Rx sensitivity penalty.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b693e3575a00df3ef0e464e2e01c005
https://doi.org/10.1109/oic.2013.6552899
https://doi.org/10.1109/oic.2013.6552899
Autor:
Finn Kræmer
Publikováno v:
Politica. 12:149
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::720df313ca9b52886218bac4f4d51487
https://doi.org/10.7146/politica.v12i1.67232
https://doi.org/10.7146/politica.v12i1.67232
Conference
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