Zobrazeno 1 - 10
of 24
pro vyhledávání: '"Filip Vanhee"'
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 7:1957-1964
Fatigue performance of solder joints in four-point bending test is evaluated by finite-element modeling. A simplified modeling technique is implemented in order to focus on the behavior of the critical solder joint. The fatigue life is estimated by t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d5dc2f30c79f4086679903d3c184325
https://doi.org/10.1109/tcpmt.2017.2739808
https://doi.org/10.1109/tcpmt.2017.2739808
Autor:
Bart Allaert, Riet Labie, Johan De Baets, Lieven Degrendele, Filip Vanhee, Franco Zanon, Bart Vandevelde, Ralph Lauwaert, Geert Willems, Davy Pissoort
Publikováno v:
Microelectronics Reliability. 74:131-135
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9caa99dda3b89f37183922e5af839a8b
https://doi.org/10.1016/j.microrel.2017.04.008
https://doi.org/10.1016/j.microrel.2017.04.008
Autor:
Riet Labie, Davy Pissoort, Jan Mehner, Ralph Lauwaert, Filip Vanhee, Chinmay Nawghane, Bart Allaert, Bart Vandevelde, Ingrid De Wolf
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
This paper is aimed at researching the impact of vibrations on chip scale packages (CSPs) assembled on a printed circuit board (PCB) and exploring finite element technique to investigate PCB assembly under vibration load. Importance of experimental m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4cd779f7d07692f21dfdcc3375f2e0e3
https://doi.org/10.1109/eurosime.2018.8369950
https://doi.org/10.1109/eurosime.2018.8369950
Autor:
Emil Dimitrov Manolov, Filip Vanhee, Bart Boesman, Marin Hristov, Renaat De Craemer, Davy Pissoort, Dimitar Nikolov
Publikováno v:
IET Wireless Sensor Systems. 5:106-113
The capability to efficiently harvest power from ambient energy sources is a crucial element for the development of low-maintenance wireless sensor networks. Available energy levels that can be harvested from ambient electromagnetic (EM) sources are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c55635c3f6abe3f36c0acb23be130c58
https://doi.org/10.1049/iet-wss.2013.0140
https://doi.org/10.1049/iet-wss.2013.0140
Publikováno v:
2017 International Symposium on Electromagnetic Compatibility - EMC EUROPE.
In this paper, a novel and versatile stripline set-up dedicated to the characterization of the high-frequency shielding effectiveness of board-level shields is presented. The stripline setup is based upon the stripline set-up described in SAE ARP6248
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::47a0cee0bce076a6f25c62dda046329f
https://doi.org/10.1109/emceurope.2017.8094619
https://doi.org/10.1109/emceurope.2017.8094619
Publikováno v:
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).
This paper studies the influence of a gasket's shape and size on its high-frequency shielding-effectiveness as measured with the stripline test method. Based on full-wave simulations it is shown that the main influencing parameter for the shielding-e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5272e562187f318d829c319296940554
https://doi.org/10.1109/isemc.2017.8077949
https://doi.org/10.1109/isemc.2017.8077949
Publikováno v:
IEEE Transactions on Electromagnetic Compatibility. 55:208-216
In this paper, an efficient reciprocity-based algorithm is proposed to predict the worst case voltages and currents induced by external plane waves at the ports of a multiconductor transmission-line system. The proposed algorithm consists of two main
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eddcb9b146ae9002c342ccb57f1a9611
https://doi.org/10.1109/temc.2012.2208754
https://doi.org/10.1109/temc.2012.2208754
Publikováno v:
2016 International Symposium on Electromagnetic Compatibility - EMC EUROPE.
When teaching electromagnetics and electromagnetic compatibility (EMC) to engineering students and graduated engineers, it is important to bridge the gap between theory and practice. To reduce the need for a broad range of expensive and voluminous de
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca3f64ff5e73aefb45e2fa49c4dec923
https://doi.org/10.1109/emceurope.2016.7739177
https://doi.org/10.1109/emceurope.2016.7739177
Publikováno v:
2016 ESA Workshop on Aerospace EMC (Aerospace EMC).
Due to the impact of higher and higher frequencies in a lot of applications, the Shielding Effectiveness (SE) characterisation of materials is expanding from LF up to frequencies well above 1 GHz. Additionally, requirements with respect to energy-eff
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::552df848356c5d630f1c1c58a3ddb530
https://doi.org/10.1109/aeroemc.2016.7504547
https://doi.org/10.1109/aeroemc.2016.7504547
Autor:
Bart Vandevelde, Johan De Baets, Bart Allaert, Filip Vanhee, Geert Willems, Davy Pissoort, Ralph Lauwaert, Riet Labie, Lieven Degrendele
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::62d8152507a0b79bc919fbcf066b25c9
https://lirias.kuleuven.be/handle/123456789/603652
https://lirias.kuleuven.be/handle/123456789/603652
